SOT602-1: HBGA256


Overview

plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA256 surface mount bottom HBGA 256 plastic
Manufacture Code Reference Codes Issue Date
SOT602 MS-034(JEDEC);144E(IEC 2003-03-17