SOT707-1: HBGA584

Overview

plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT707-1	HBGA584	surface mount	bottom	HBGA		584	plastic

Manufacture Code	Reference Codes	Issue Date
SOT707		2002-11-22