SOT1151-1: HBGA640

Overview

plastic thermal enhanced ball grid array package; 640 balls; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1151-1	HBGA640	surface mount	bottom	HBGA	27 x 27 x 2.4	640	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1151	MS-034D compliant(JEDEC	2009-10-19