SOT1123-2: HBGA324

Overview

plastic thermal enhanced ball grid array package; 324 balls; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1123-2	HBGA324	surface mount	bottom	HBGA	23 x 23 x 1.73	324	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1123	MS-034(JEDEC);144E(IEC	2010-01-06