SOT799-1: HBGA564

Overview

plastic thermal enhanced ball grid array package; 564 balls; body 40 x 40 x 1.75 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT799-1	HBGA564	surface mount	bottom	HBGA		564	plastic

Manufacture Code	Reference Codes	Issue Date
SOT799	MS-034(JEDEC);144E(IEC	2002-11-18