SOT807-1: HBGA156

Overview

plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT807-1	HBGA156	surface mount	bottom	HBGA		156	plastic

Manufacture Code	Reference Codes	Issue Date
SOT807	MS-034(JEDEC	2003-03-06