SOT553-1: HBGA292

Overview

plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT553-1	HBGA292	surface mount	bottom	HBGA		292	plastic

Manufacture Code	Reference Codes	Issue Date
SOT553	MS-034(JEDEC);144E(IEC	2002-02-27