SOT953-1: HBGA432

Overview

plastic thermal enhanced ball grid array package; 432 balls; body 35 x 35 x 1.75 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT953-1	HBGA432	surface mount	bottom	HBGA		432	plastic

Manufacture Code	Reference Codes	Issue Date
SOT953	MS-034(JEDEC);144E(IEC	2006-06-21