SOT850-1: HBGA256

Overview

plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT850-1	HBGA256	surface mount	bottom	HBGA		256	plastic

Manufacture Code	Reference Codes	Issue Date
SOT850	MS-034(JEDEC	2004-03-19