SOT948-1: HBGA1092


Overview

plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA1092 surface mount bottom HBGA 1092 plastic
Manufacture Code Reference Codes Issue Date
SOT948 MS-034(JEDEC);144E(IEC 2006-05-31