SOT1163-1: HBGA360

Overview

plastic, thermal enhanced ball grid array package; 360 balls; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1163-1	HBGA360	surface mount	bottom	HBGA	23 x 23 x 1.75	360	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1163	MS-034(JEDEC);144E(IEC	2010-01-22