MC33PF8200DEES Product Information|NXP

Features


Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, ASIL-B, Auto, QFN 56

Package


HVQFN56: HVQFN56, plastic, thermally enhanced very thin quad flat package, no-leads, wettable flanks; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body

Buy Options

MC33PF8200DEES

Active

12NC: 935376115557

Details

Quantity

Unit Pricing

1 - 25$6.79
26 - 99$6.26
100+$5.74

Order

$6.79 USD
In Stock:150
Order from distributors

Operating Features

ParameterValue
MCU Supported
i.MX 8X
Supply Voltage [min] (V)
2.7
Supply Voltage [max] (V)
5.5
Output Current (A)
10
Number of Buck Regulators
7
Number of LDO
4
Switching Frequency LV Buck (MHz)
2, 3
Number of Boost Regulators
0
Number of Channels
12
ParameterValue
Battery Charger
coin cell battery
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105
Safety Level
up to ASIL A, up to ASIL B
Device Function
PMICs for high performance applications processor, PMICs for i.MX 8QPX + LDDR4
Interface and Input Control
I2C
Additional Features - Analog
AMUX, Frequency Tuning, Functional Safety ASIL-B, Multi-Phase, Spread Spectrum, Voltage Monitoring
Junction Temperature (Min to Max) (℃)
-40 to 150
Development Tools
KITPF8200FRDMEVM

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC33PF8200DEES(935376115557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
191.4
MC33PF8200DEESR2(935376115697)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
191.229

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead SolderingLead Free SolderingLead SolderingLead Free Soldering
MC33PF8200DEES
(935376115557)
ISO 26262
3
260
260
40
40
MC33PF8200DEESR2
(935376115697)
ISO 26262
3
-
260
-
40

Shipping

Part/12NCHarmonized Tariff (US)Disclaimer
MC33PF8200DEES
(935376115557)
854239
MC33PF8200DEESR2
(935376115697)
854239

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC33PF8200DEES
(935376115557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC33PF8200DEESR2
(935376115697)
MC33PF8200DEES
(935376115557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC33PF8200DEESR2
(935376115697)
MC33PF8200DEES
(935376115557)
2020-08-192020-08-20202008022IPF8100_PF8200 Errata Update Rev 2.0 for Output Overshoot / Undershoot
MC33PF8200DEESR2
(935376115697)
MC33PF8200DEES
(935376115557)
2020-06-102020-06-11202006004IMC33PF8200DEES OTP Configuration Report Update / Correction
MC33PF8200DEESR2
(935376115697)
MC33PF8200DEES
(935376115557)
2019-11-212019-11-22201909005IPF8100-PF8200 Data Sheet Updates Rev 8.0 and 9.0 for Ordering Information and Clarifications
MC33PF8200DEESR2
(935376115697)

More about PF81-PF82

The PF81/PF82 PMIC family is designed for high-performance processing applications such as infotainment, telematics, clusters, vehicle networking, ADAS, vision and sensor fusion.

Two versions are available to address different market needs:

  • The PF82 with functional safety to comply with the ISO 26262 standard, provides a powerful and flexible solution for ASILB (D) automotive applications.
  • The PF81 is the basic version of this product, with power management and digital control without the functional safety features for systems not requiring ASILB compliance.

This family is ideal for i.MX 8, i.MX 8X and S32V processors’ based applications and suitable for powering Layerscape LS1043A and other high-performance processors. It offers seven high-efficiency buck converters and four linear regulators to power the processor, memory and miscellaneous peripherals.

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