Find mechanical outline drawings and related information.
| Package Version | Package Name | Package Description | Reference Codes | Issue Date |
|---|---|---|---|---|
| SOT1128-1 | HLQFP256 | plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; heatsink | MS-026(JEDEC | 2008-12-19 |
| SOT1304-1 | HLQFP176 | plastic thermal enhanced low profile quad flat package, 176 terminals, 0.4 mm pitch, 20 mm x 20 mm x 1.4 mm body | MS-026(JEDEC | 2011-04-20 |
| SOT1313-1 | HLQFP208 | plastic thermal enhanced low profile quad flat package: 208 leads | MS-026(JEDEC | 2011-11-04 |
| SOT1313-2 | HLQFP208 | HLQFP208, plastic, thermal enhanced low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body | 2017-06-11 | |
| SOT1510-1 | HLQFP64 | HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad | MS-026 BCD(JEDEC | 2018-08-07 |
| SOT1510-2 | HLQFP64 | HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body | MS-026 BCD(JEDEC | 2018-06-29 |
| SOT1510-3 | HLQFP64 | HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body | FL-PQFP-G64(JEDEC | 2017-06-11 |
| SOT1510-4 | HLQFP64 | plastic, thermal enhanced low profile quad flat package; 64 leads; body 10 x 10 x 1.5 mm | 2016-07-12 | |
| SOT1570-1 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body | 2016-01-08 | |
| SOT1570-2 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body | 2017-03-27 | |
| SOT1570-3 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2018-03-02 | |
| SOT1570-5 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2021-12-14 | |
| SOT1570-6 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2023-09-07 | |
| SOT1571-1 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026-BBC(JEDEC | 2017-12-14 |
| SOT1571-2 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2017-06-11 |
| SOT1571-3 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2017-06-11 |
| SOT1571-4 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | 2017-06-11 | |
| SOT1571-5 | HLQFP48 | plastic, thermal enhanced low profile quad flat package; 48 leads; body 7 x 7 x 1.5 mm | 2016-07-14 | |
| SOT1571-6 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.5 mm body; 4.4 mm x 4.4 mm exposed pad | 2022-03-30 | |
| SOT1571-7 | HLQFP48 | plastic, thermal enhanced low profile quad flat package; 48 leads; 0.5 mm pitch, 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2017-08-28 |
| SOT1571-8 | HLQFP48 | HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body | MS-026 BBC(JEDEC | 2018-03-01 |
| SOT1572-1 | HLQFP80 | HLQFP80, plastic, thermal enhanced, low profile quad; flat leaded package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1.4 mm body | 2017-03-27 | |
| SOT1660-1 | HLQFP156 | HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body | NON-JEDEC(JEDEC | 2017-06-11 |
| SOT1660-2 | HLQFP156 | HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body | 2018-10-26 | |
| SOT1898-1 | HLQFP64 | plastic, thermal enhanced low profile quad flat package; 64 leads; 14 x 14 x 1.5 mm body; exposed die pad | 2016-09-01 | |
| SOT2229-1 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.5 mm body | 2024-07-12 | |
| SOT470-1 | HLQFP100 | plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; heatsink | MS-026(JEDEC | 2003-02-20 |
| SOT470-2 | HLQFP100 | plastic thermal enhanced low profile quad flat package; 100 leads; exposed die pad | MS-026(JEDEC | 2013-04-24 |
| SOT470-4 | HLQFP100 | HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body | 2016-03-18 | |
| SOT470-5 | HLQFP100 | plastic, thermal enhanced low profile quad flat package; 100 leads; body 14 mm x 14 mm x 1.6 mm; exposed die pad | 2017-03-03 | |
| SOT612-2 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad | MS-026(JEDEC | 2004-07-05 |
| SOT612-3 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad | MS-026(JEDEC | 2004-07-05 |
| SOT612-4 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad | MS-026(JEDEC | 2008-01-18 |
| SOT612-5 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad | MS-026(JEDEC | 2008-11-21 |
| SOT612-6 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad | MS-026(JEDEC | 2010-02-25 |
| SOT612-7 | HLQFP144 | plastic thermal enhanced low profile quad flat package; 144 leads | MS-026(JEDEC | 2011-11-28 |
| SOT766-1 | HLQFP176 | plastic thermal enhanced low profile quad flat package; 176 leads; body 24 mm x 24 mm x 1.4 mm; exposed die pad | MS-026(JEDEC | 2002-06-13 |
| SOT766-2 | HLQFP176 | Plastic thermal enhanced low profile quad flat package; 176 leads, 0.5 mm pitch, 24 mm x 24 mm x 1.4 mm body | MS-026(JEDEC | 2014-04-01 |
| SOT766-4 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-06-11 | |
| SOT766-5 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.50 mm pitch; 24 mm x 24 mm x 1.6 mm body | 2017-03-27 | |
| SOT766-6 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-06-11 | |
| SOT766-7 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad; flat leaded package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-03-27 | |
| SOT766-9 | HLQFP176 | HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body | 2017-06-11 | |
| SOT792-1 | HLQFP44 | plastic thermal enhanced low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm; heatsink | MS-026(JEDEC | 2002-11-15 |
| SOT848-2 | HLQFP128 | HLQFP128, plastic, thermal enhanced low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body | 2017-06-11 | |
| SOT848-3 | HLQFP128 | HLQFP128, plastic, thermal enhanced low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body | 2017-03-08 |
