MC33FS6517NAE Product Information|NXP

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Operating Features

ParameterValue
AEC-Q100 Temperature Range
grade 1
ASIL Certification
up to ASIL A, up to ASIL B
Additional Features - Security
1x Fail-safe output, Challenger Watchdog, External IC monitoring, FCCU monitoring, Reset Output, UV/OV Monitoring
Additional Features - Analog
bus short-circuit to battery, overcurrent, overcurrent protected bus, overtemperature, overvoltage, short-circuit, undervoltage
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Device Function
SMPS, linear regulators, system basis chip
Diagnostics
SPI
MCU Supported
MPC56xx, MPC57xx
Num. of Linear/LDO Regulators
3
ParameterValue
Number of Boost Regulators
1
Number of Buck Regulators
2
Protection
overcurrent, overtemperature, overvoltage, short-circuit, undervoltage
Output Current (A)
1.5
Sample Exception Availability
N
Supply Voltage [min] (V)
2.7
Supply Voltage [max] (V)
40
Recommended Superset
MC33FS6527LAE, MC33FS6528CAE

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
MC33FS6517NAE(935426136557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
187.5
MC33FS6517NAER2(935426136528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
187.5

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC33FS6517NAE
(935426136557)
ISO 26262
3
260
40
MC33FS6517NAER2
(935426136528)
ISO 26262
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)Disclaimer
MC33FS6517NAE
(935426136557)
854239
MC33FS6517NAER2
(935426136528)
854239

More about FS6500

The FS65 system basis chip (SBC) provides power to MCUs and optimizes energy consumption through DC-DC switching regulators, linear regulators and ultra-low-power saving modes.

Featuring:

  • Advanced functional safety measures to target ASIL B/D applications
  • A serial peripheral interface (SPI) to allow control and diagnostics with the MCU
  • Integration of CAN FD and LIN physical interfaces compliant with the ISO 11898-2,-5, LIN 2.2, 2.1 /J2602-2 standards along with the latest automotive OEM standards for EMC and ESD
  • A range of integrated safety features such as monitoring of critical analog parameters, a fail-safe state machine and an advanced watchdog reduce software complexity with dual-core lock-step MCUs
  • High-temperature capability up to TA = 150 °C and TJ = 175 °C, compliant with AEC-Q100 Grade 0 automotive qualification