MC33FS6500NAE Product Information|NXP

Buy Options

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC33FS6500NAE(935318679557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
187.5
MC33FS6500NAER2(935318679528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
187.5

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC33FS6500NAE
(935318679557)
ISO 26262
3
260
40
MC33FS6500NAER2
(935318679528)
ISO 26262
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)Disclaimer
MC33FS6500NAE
(935318679557)
854239
MC33FS6500NAER2
(935318679528)
854239

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC33FS6500NAE
(935318679557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC33FS6500NAER2
(935318679528)
MC33FS6500NAE
(935318679557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC33FS6500NAER2
(935318679528)
MC33FS6500NAE
(935318679557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MC33FS6500NAER2
(935318679528)

More about FS6500

The FS65 system basis chip (SBC) provides power to MCUs and optimizes energy consumption through DC-DC switching regulators, linear regulators and ultra-low-power saving modes.

Featuring:

  • Advanced functional safety measures to target ASIL B/D applications
  • A serial peripheral interface (SPI) to allow control and diagnostics with the MCU
  • Integration of CAN FD and LIN physical interfaces compliant with the ISO 11898-2,-5, LIN 2.2, 2.1 /J2602-2 standards along with the latest automotive OEM standards for EMC and ESD
  • A range of integrated safety features such as monitoring of critical analog parameters, a fail-safe state machine and an advanced watchdog reduce software complexity with dual-core lock-step MCUs
  • High-temperature capability up to TA = 150 °C and TJ = 175 °C, compliant with AEC-Q100 Grade 0 automotive qualification
More