MCF52256CVN66 Product Information|NXP

Features


MCF522XX 32-bit MCU, ColdFire V2 core, 256KB Flash, 66MHz, MAPBGA 144

Package


LBGA144: LBGA144, plastic, low profile ball grid array; 144 balls; 1 mm pitch; 13 mm x 13 mm x 1.46 mm body

Buy Options

MCF52256CVN66

Active

12NC: 935313986557

Details

Order

Order from distributors

Operating Features

ParameterValue
Operating Frequency [Max] (MHz)
66
Flash (kB)
256
RAM (kB)
64
GPIO
96
ParameterValue
Supply Voltage [min] (V)
3
Supply Voltage [max] (V)
3.6
Ambient Operating Temperature (Min to Max) (℃)
-40 to 85

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MCF52256CVN66(935313986557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
443.7

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MCF52256CVN66
(935313986557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)FootprintCapture Symbol
MCF52256CVN66
(935313986557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MCF52256CVN66
(935313986557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MCF52256CVN66
(935313986557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MCF52256CVN66
(935313986557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MCF52256CVN66
(935313986557)
2017-08-242017-11-21201707002F01MCF5225X Fab Site Expansion (TSMC3 to NXP-CHD)

More about MCF5225X

The MCF5225x family consists of highly integrated devices with on-chip USB, Ethernet, CAN and encryption functions featuring the complete MQX™ RTOS software at no additional cost. This solution is ideal for factory automation, building control and medical applications.