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Package Version Package Name Package Description Reference Codes Issue Date
SOT1181-1 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad MS-026(JEDEC 2010-08-04
SOT1181-2 HTQFP48 HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad MS-026(JEDEC 2012-10-23
SOT1522-1 HTQFP128 HTQFP128, plastic, thermal enhanced thin quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G128(JEDEC 2017-06-11
SOT1580-1 HTQFP216 HTQFP216, plastic, thermal enhanced thin quad flat package; 216 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1 mm body 2017-06-11
SOT513-1 HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink 2003-02-20
SOT513-2 HTQFP80 HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G80(JEDEC 2017-06-11
SOT545-1 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC 2004-01-29
SOT545-2 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC 2004-01-29
SOT545-3 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC 2004-02-05
SOT638-1 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2005-02-02
SOT638-2 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2005-02-02
SOT638-3 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2008-04-08
SOT638-4 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2008-11-12
SOT638-5 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2008-11-12
SOT638-6 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad, 0.5 mm pitch, 14 mm x 14 mm x 1 mm body 2009-09-01
SOT638-7 HTQFP100 HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G100(JEDEC 2017-06-11
SOT638-8 HTQFP100 HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G100(JEDEC 2017-06-11
SOT780-1 HTQFP52 plastic thermal enhanced thin quad flat package; 52 leads; body 10 x 10 x 1 mm; exposed die pad MS-026(JEDEC 2002-09-04
SOT841-1 HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad MS-026(JEDEC 2004-01-15
SOT841-2 HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad MS-026(JEDEC 2004-04-21
SOT841-4 HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad MS-026(JEDEC 2006-06-20
SOT841-5 HTQFP80 HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1 mm body TS-PQFP-G80(JEDEC 2017-06-11
SOT855-1 HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad MS-026(JEDEC 2005-05-11
SOT855-2 HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; 10 x 10 x 1 mm; exposed diepad 2010-02-15
SOT855-3 HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad MS-026(JEDEC 2010-04-22
SOT855-4 HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad MS-026(JEDEC 2011-04-12
SOT855-5 HTQFP64 HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body 2018-12-18
SOT855-6 HTQFP64 HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body; exposed die pad 2021-12-14