S32G2 Safe and Secure Vehicle Network Processor | NXP Semiconductors

S32G2 Processors for Vehicle Networking

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S32G2 Processors for Vehicle Networking

S32G2 Processor

S32G2 Processors for Vehicle Networking Software Ecosystem

S32G2 Processors Software Ecosystem

Features

Main features

  • Quad Arm® Cortex®-A53 cores with Arm Neon™ technology organized in two clusters of two cores with optional cluster lockstep for applications and services
  • Triple Arm Cortex-M7 lockstep cores for real-time applications
  • Low Latency Communication Engine (LLCE) for automotive networks acceleration
  • Packet Forwarding Engine (PFE) for Ethernet networks acceleration
  • Hardware Security Engine (HSE) for secure boot and accelerated security services
  • Advanced functional safety hardware and software for ASIL D systems
  • AEC-Q100 Grade 2 device: -40 °C to 105 °C

Software Enablement

Offered software support enables the S32G2 features running on the Arm Cortex-M7 and Cortex-A53, plus the accelerators. Explore the vast available software solutions to help users build their applications. Read more

Tools Reference Software Standard Software Premium Software

S32 Design Studio for S32 Platform

FreeMASTER Run-Time Debugging Tool

eIQ® Auto Machine Learning (ML) Toolkit

Linux BSP

FreeRTOS™

Integration Reference Examples

USB Stack

TCP/IP Stack

SDHC Stack

S32G Board Diagnostic Tests

S32 Real-Time Drivers (RTD)

Safety Peripheral Drivers (SPD)

Inter-Platform Comm Framework (IPCF)


PFE Driver + Standard Firmware

LLCE Driver Standard Firmware

HSE Standard Firmware

S32 Security

S32 Safety

Vehicle Integration Platform

S32G GoldVIP: Accelerates S32G evaluation, development, integration and rapid prototyping efforts.

Software Package Manager

Use the Automotive Software Package Manager to navigate the offerings, view product briefs and release notes and easily download software. Launch Software Package Manager

NXP Support

Contact an NXP representative for more information. Support Home

SafeAssure NDA group

Available through NXP Secure Content Request Access

Buy/Parametrics

Quick reference to our part nomenclature.

4 results

Include 5 NRND

Order

CAD Model

Core Type

Lockstep

Operating Frequency [Max] (MHz)

RAM (kB)

Standby RAM

External Memory Supported

Serial Communication

Number of LIN Channels

Flexray

CAN

CAN FD

Ethernet MACs

Ethernet Type

PCIe

USB

Security Modules

Hardware Isolation

Timer

PWM [Number, bits]

ADC [Number, bits]

JTAG Debug

Aurora Trace

Supply Voltage [Min to Max] (V)

Ambient Operating Temperature (Min to Max) (℃)

Junction Temperature (Min to Max) (℃)

Package Type

Package Pitch (mm)

SafeAssure Functional Safety

ASIL Certification

AEC-Q100 Temperature Range

2 x Arm Cortex-A53, 3 x Arm Cortex-M7

Yes

400, 1000

8000

32000

DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND

10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C

4

2

20

20

4

MII, RGMII, RMII, SGMII

2 x PCIe 3.0

1 x USB OTG

HSE_H

XRDC

7 x WDT x 32, 8 x STM x 32

6 x 32

12 x 12

Y

Y

0.8 to 3.45

-40 to 105

-40 to 125

FBGA525

0.8

ISO 26262

up to ASIL D

grade 2

2 x Arm Cortex-A53, 3 x Arm Cortex-M7

Yes

400, 1000

8000

32000

DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND

10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C

4

2

20

20

4

MII, RGMII, RMII, SGMII

2 x PCIe 3.0

1 x USB OTG

HSE_H

XRDC

7 x WDT x 32, 8 x STM x 32

6 x 32

12 x 12

Y

Y

0.8 to 3.45

-40 to 105

-40 to 125

FBGA525

0.8

ISO 26262

up to ASIL D

grade 2

3 x Arm Cortex-M7, 4 x Arm Cortex-A53

Yes

400, 1000

8000

32000

DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND

10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C

4

2

20

20

4

MII, RGMII, RMII, SGMII

2 x PCIe 3.0

1 x USB OTG

HSE_H

XRDC

7 x WDT x 32, 8 x STM x 32

6 x 32

12 x 12

Y

Y

0.8 to 3.45

-40 to 105

-40 to 125

FBGA525

0.8

ISO 26262

up to ASIL D

grade 2

3 x Arm Cortex-M7, 4 x Arm Cortex-A53

Yes

400, 1000

8000

32000

DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND

10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C

4

2

20

20

4

MII, RGMII, RMII, SGMII

2 x PCIe 3.0

1 x USB OTG

HSE_H

XRDC

7 x WDT x 32, 8 x STM x 32

6 x 32

12 x 12

Y

Y

0.8 to 3.45

-40 to 105

-40 to 125

FBGA525

0.8

ISO 26262

up to ASIL D

grade 2

Documentation

Quick reference to our documentation types.

1-10 of 64 documents

Compact List

Application Note (25)
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Design Files

Quick reference to our design files types.

4 design files

Hardware

Quick reference to our board types.

1-5 of 11 hardware offerings

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Software

Quick reference to our software types.

1-5 of 15 software files

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Note: For better experience, software downloads are recommended on desktop.

Engineering Services

1-5 of 12 engineering services

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To find additional partner offerings that support this product, visit our Partner Marketplace.

Training

1-5 of 46 trainings

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