Product Longevity
Participating products are available for a minimum of 10 years. Designated participating products developed for the automotive, telecom and medical segments are available for a minimum of 15 years.
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S32G3 vehicle network processors combine ASIL D safety, hardware security, high-performance real-time and application processing and network acceleration. S32G3 supports the needs of new vehicle architectures: service-oriented gateways, vehicle computers, domain controllers, zonal processors, safety processors and more.
The S32G3 vehicle network processors are supported by a broad range of software enablement that is comprised of Reference Software, Standard Software and Premium Software, in addition to support from the S32 Design Studio IDE.
The S32G3 series extends the S32G family with pinout and software compatibility with the S32G2 series.
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Offered software support enables the S32G3 features running on the Arm Cortex-M7 and Arm Cortex-A53, plus the accelerators. Explore the vast array of available software solutions to help users build their applications.
Tools | Reference Software | Standard Software | Premium Software | |
---|---|---|---|---|
S32 Design Studio for S32 Platform
FreeMASTER Run-Time Debugging Tool |
Linux BSP
FreeRTOS™
Integration Reference Examples
USB Stack
TCP/IP Stack
SDHC Stack S32G Board Diagnostic Tests |
S32 Real-Time Drivers (RTD)
Safety Peripheral Drivers (SPD)
Inter-Platform Comms Framework (IPCF) |
S32 Security
|
S32 Safety
|
Vehicle Integration Platform S32G GoldVIP: Accelerates S32G evaluation, development, integration and rapid prototyping efforts. |
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Software Package Manager Use the Automotive Software Package Manager to navigate the offerings, view product briefs and release notes and easily download software. Launch Software Package Manager |
NXP Support Contact an NXP representative for more information. Support Home |
SafeAssure NDA group Available through NXP Secure Content. Request Access |
Includes FreeRTOS™ support for the Cortex-M7 cores and Linux BSP support for the Cortex-A53 cores, as well as integration reference examples and board diagnostic tests.
Includes Real-Time Drivers for AUTOSAR® and non-AUTOSAR operating systems, safety peripheral drivers and an inter-platform communication framework for communications between the Cortex-M7 and Cortex-A53 cores and hardware accelerator drivers and firmware.
Includes premium security with expanded security capabilities and Premium Safety, which includes the S32 Safety Software Framework for functional safety implementations and Structural Core Self Test (SCST) for the Cortex-A53 cores.
Participating products are available for a minimum of 10 years. Designated participating products developed for the automotive, telecom and medical segments are available for a minimum of 15 years.
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Part | Order | CAD Model | Core Type | Lockstep | Operating Frequency [Max] (MHz) | RAM (kB) | Standby RAM | External Memory Supported | Serial Communication | Number of LIN Channels | Flexray | CAN | CAN FD | Ethernet MACs | Ethernet Type | PCIe | USB | Security Modules | Hardware Isolation | Timer | PWM [Number, bits] | ADC [Number, bits] | JTAG Debug | Aurora Trace | Package Type | Package Pitch (mm) | SafeAssure Functional Safety | ASIL Certification | AEC-Q100 Temperature Range |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3 x Arm Cortex-M7, 4 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1300 | 15000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
3 x Arm Cortex-M7, 4 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1300 | 15000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
4 x Arm Cortex-A53, 4 x Arm Cortex-M7 | Cluster, Dual-Core | 400, 1300 | 20000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
4 x Arm Cortex-A53, 4 x Arm Cortex-M7 | Cluster, Dual-Core | 400, 1300 | 20000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
3 x Arm Cortex-M7, 8 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1000 | 15000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
3 x Arm Cortex-M7, 8 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1100 | 15000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
3 x Arm Cortex-M7, 8 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1300 | 15000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
3 x Arm Cortex-M7, 8 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1000 | 15000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
3 x Arm Cortex-M7, 8 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1300 | 15000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 | |||
4 x Arm Cortex-M7, 8 x Arm Cortex-A53 | Cluster, Dual-Core | 400, 1000 | 20000 | 32000 | DDR3L SDRAM, LPDDR4 DRAM, QSPI NOR, SD3.0/eMMC5.1 NAND | 10 x SPI, 2 x FlexRay, 3 x UART, 5 x I²C | 4 | 2 | 20 | 20 | 4 | MII, RGMII, RMII, SGMII | 2 x PCIe 3.0 | 1 x USB OTG | HSE_H | XRDC | 12 x WDT x 32, 13 x STM x 32 | 6 x 32 | 12 x 12 | Y | Y | FBGA525 | 0.8 | ISO 26262 | up to ASIL D | grade 2 |
S32G3
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