MFS2320BMBA0EP Product Information|NXP

Features


Safety SBC with Power Management, CAN and LIN

Package


HVQFN48: HVQFN48, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 48 terminals; 0.5 mm pitch, 7 mm x 7 mm x 0.9 mm body

Buy Options

MFS2320BMBA0EP

Active

12NC: 935453654557

Details

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In Stock:2,652
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Operating Features

ParameterValue
Supply Voltage [min] (V)
5.5
Supply Voltage [max] (V)
40
Output Current (A)
0.7
Num. of Linear/LDO Regulators
2
Number of Buck Regulators
1
Number of LDO
2
Regulators-Buck Switching
1 HV buck output 3.3V to 5V
Switching Frequency HV Buck (KHz)
450, 2200
Number of Channels
3
IQ (μA)
20, 30
Battery Charger
No battery charger
CAN PHY
1
ParameterValue
Safety Level
up to ASIL B
Voltage Monitoring
1
MCU Supported
S32K1, S32K3
Device Function
system basis chip
Diagnostics
ABIST
Interface and Input Control
I2C, SPI
Additional Features - Analog
AMUX, High-side drivers, I/Os, LDT, Wake-up inputs
AEC-Q100 Temperature Range
grade 1
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Junction Temperature (Min to Max) (℃)
-40 to 150
Development Tools
KITFS23BUCKEVM, KITFS23LDOEVM, KITFS23SKTEVM
Product Application
Body

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
MFS2320BMBA0EP(935453654557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
191.4
MFS2320BMBA0EPR2(935453654528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
191.4

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MFS2320BMBA0EP
(935453654557)
ISO 26262
3
260
40
MFS2320BMBA0EPR2
(935453654528)
ISO 26262
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)Disclaimer
MFS2320BMBA0EP
(935453654557)
854239
MFS2320BMBA0EPR2
(935453654528)
854239

More about FS23

The FS23 system basis chip (SBC) offers an expandable family of devices which is pin-to-pin and software compatible. It is scalable from LDO version to DC-DC version as well as from QM to ASIL B. The FS23 SBC includes CAN and LIN transceivers along with a number of system features commonly found in the latest generation of automotive electronic control units (ECUs).

The FS23 SBC is system-added value, offering a high level of integration in order to optimize the bill of material (BOM) cost for the body and comfort market.

The device is suitable for S32K processor-based applications, as well as multi-vendor processors, thanks to its high level of flexibility.

FS23 silicon and enablement (documentation, software and boards) are available for select customers (NDA required). Please contact your local NXP sales representative for more information.

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