Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
HVQFN48: HVQFN48, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 48 terminals; 0.5 mm pitch, 7 mm x 7 mm x 0.9 mm body
Buy Options
MFS2303BMBA3EP
Active
12NC: 935453652557
Details
Quantity
Unit Pricing
| 1 - 25 | $3.50 |
| 26 - 99 | $3.23 |
| 100+ | $2.96 |
Order
In Stock:1,124
Order from distributorsMFS2303BMBA3EPR2
Active
12NC: 935453652528
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Supply Voltage [min] (V) | 5.5 |
Supply Voltage [max] (V) | 40 |
Output Current (A) | 0.1 |
Num. of Linear/LDO Regulators | 3 |
Number of LDO | 3 |
Number of Channels | 3 |
IQ (μA) | 30, 40 |
Battery Charger | No battery charger |
CAN PHY | 1 |
LIN PHY | 1 |
Safety Level | up to ASIL B |
| Parameter | Value |
|---|---|
Voltage Monitoring | 1 |
MCU Supported | S32K1 |
Device Function | system basis chip |
Diagnostics | ABIST, FCCU, Watchdog |
Interface and Input Control | SPI |
Additional Features - Analog | 2 I/Os, 2 Wake-up inputs, 4 High-side drivers, AMUX, LDT |
AEC-Q100 Temperature Range | grade 1 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
Junction Temperature (Min to Max) (℃) | -40 to 150 |
Development Tools | KITFS23LDOEVM, KITFS23SKTEVM |
Product Application | Body and comfort, End nodes |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
MFS2303BMBA3EP(935453652557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 191.4 |
MFS2303BMBA3EPR2(935453652528) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | REACH SVHC | 191.4 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MFS2303BMBA3EP (935453652557) | ISO 26262 | 3 | 260 | 40 | |||
MFS2303BMBA3EPR2 (935453652528) | ISO 26262 | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer |
|---|---|
MFS2303BMBA3EP (935453652557) | 854239 |
MFS2303BMBA3EPR2 (935453652528) | 854239 |
More about FS23
The FS23 system basis chip (SBC) offers an expandable family of devices which is pin-to-pin and software compatible. It is scalable from LDO version to DC-DC version as well as from QM to ASIL B. The FS23 SBC includes CAN and LIN transceivers along with a number of system features commonly found in the latest generation of automotive electronic control units (ECUs).
The FS23 SBC is system-added value, offering a high level of integration in order to optimize the bill of material (BOM) cost for the body and comfort market.
The device is suitable for S32K processor-based applications, as well as multi-vendor processors, thanks to its high level of flexibility.
FS23 silicon and enablement (documentation, software and boards) are available for select customers (NDA required). Please contact your local NXP sales representative for more information.