i.MX RT1170: 1 GHz Crossover MCU with Arm® Cortex® Cores
2.4/5 GHz Dual-Band 1x1 Wi-Fi® 4 (802.11n) + Bluetooth® 5.2 Solution
The 88W8977 System-on-Chip (SoC) is a highly integrated single-chip solution that incorporates both Wi-Fi (2.4/5 GHz) and Bluetooth technology. The IEEE 802.11n compliant dual-band system-on-chip offers Wi-Fi data rates up to MCS 7 (150 Mbit/s). The SoC is specifically designed to support the speed, reliability, and quality requirements of devices such as wearables, Internet of Things (IoT) and smart home applications. The Combo solution provides both simultaneous and independent operation of the IEEE 802.11n compliant 1x1 spatial stream and Bluetooth 5.2 with high speeds and mesh networking for increased Internet of Things (IoT) functionality.
Wireless modules based on the NXP 88W8977 are offered by leading module manufacturers.
Product Details
Features
Wi-Fi Key Features
- Support 802.11 a/b/g/n
- Dual band: 2.4 GHz and 5 GHz
- Single stream 802.11n with 20 MHz and 40 MHz channels
- Up to MCS7 data rates (150 Mbps)
- Support 802.11mc for location
- Security: support WPA/WPA2 mixed mode and WPA3 security standards
Bluetooth key features
- Bluetooth 5.2 features
- Direction Finding—Connection-oriented Angle of Arrival (AoA)
- PCM audio interface
- Security: AES
Host Interfaces
- Wi-Fi host interfaces: SDIO 3.0
- Bluetooth host interfaces: UART and SDIO 3.0
Operating Characteristics
- Supply voltage: 1.8 V
- Operating temperature
- Extended: -30 to 85°C
- Industrial: -40 to 85°C
Partner Modules
88W8977
2.4/5 GHz Dual-Band 1x1 Wi-Fi® 4 (802.11n) + Bluetooth® 5.2 Solution| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
|
ENWF9201A1EF |
SDIO | UART | -30 to 85 | Chip or Pin | 1 | SMD | 17.5 x 10 x 2.6 | FCC | i.MX 6/7/8, i.MX RT |
|
ENWF9202A1EF |
SDIO | UART | -30 to 85 | Chip or Pin | 1 | SMD | 17.5 x 10 x 2.6 | CE RED | i.MX 6/7/8, i.MX RT |
|
ENWF9203A1EF |
SDIO | UART | -30 to 85 | Chip or Pin | 1 | SMD | 17.5 x 10 x 2.6 | ISED | i.MX 6/7/8, i.MX RT |
|
ENWF9208A1EF |
SDIO | UART | -30 to 85 | Chip or Pin | 1 | SMD | 17.5 x 10 x 2.6 | CE RED, FCC, ISED | i.MX 6/7/8, i.MX RT |
|
ENWF9209A1EF |
SDIO | UART | -30 to 85 | Chip or Pin | 1 | SMD | 17.5 x 10 x 2.6 | i.MX 6/7/8, i.MX RT |
Related products
i.MX RT1050 Crossover MCU with Arm® Cortex®-M7 Core
i.MX RT1064: Crossover MCU with Arm® Cortex®-M7
i.MX RT1060: Crossover MCU with Arm® Cortex®-M7
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Documentation
Quick reference to our documentation types.
3 documents
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Application Note
Bluetooth Direct Test Mode (DTM) - Application note
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Application Note
Wi-Fi/Bluetooth/802.15.4 M.2 Key E Pinout Definition
Design Resources
Software
Quick reference to our software types.
1 software file
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Examples and Quick Start Software
MCUXpresso Software Development Kit (SDK)
Note: For better experience, software downloads are recommended on desktop.
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
1-5 of 6 engineering services
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Independent Design House (IDH)
Hardware Engineering
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Independent Design House (IDH)
Elektrobit DLE Digital Life Experience
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Original Design Manufacturer (ODM)
Original Design Manufacturing (ODM)
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Independent Design House (IDH)
Embedded Connectivity
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Independent Design House (IDH)
Design Services
To find additional partner offerings that support this product, visit our Partner Marketplace.