i.MX RT1170: 1 GHz Crossover MCU with Arm® Cortex® Cores
88W8987 (Automotive): 2.4/5 GHz Dual-Band 1x1 Wi-Fi® 5 (802.11ac) + Bluetooth® 5.2 Solution
The 88W8987 automotive wireless SoC is a highly integrated IEEE 802.11ac (wave2) transceiver and Bluetooth 5.2 single-chip foot print compatible combo solution, specifically designed to support the speed, reliability and quality requirements for automotive applications. Further, this device meets the challenges of high-temp environments by being AEC-Q100 Grade 3 (-40°C to 85°C) qualified. The device includes integrated front end resulting in low external component cost.
Product Details
Block Diagram
Features
- IEEE 802.11ac (wave2)
- MU-MIMO receive
- Virtual Dual MAC (via optimized DRCS)
- Wi-Fi Stations (STA), Access Point (AP), Wi-Fi Direct (P2P)
- WPA3 Encryption
- Bluetooth 5.2 support, including Bluetooth Low Energy 5.1, 2 Mbps
- 2-antenna configuration for Wi-Fi/Bluetooth coexistence
- AEC-Q100 Grade 3 Qualification (-40 °C to +85 °C)
- 68-pin 8 x 8 mm QFN with wettable flanks
Part numbers include: 88W8987-A2-EAHE, 88W8987-A2-NYEA, 88W8987-A2-NYEE, 88W8987-A2-NYEI, 88W8987SA2-NYEA.
Buy/Parametrics
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Design Resources
Hardware
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board types.
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Evaluation and Development BoardsJODY-W2 EVK
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ModuleJODY-W2
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ModuleJODY-W2 M.2 cardNEW
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Engineering Services
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Independent Design House (IDH)
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Hardware/Software Engineering Services
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Original Design Manufacturing (ODM)
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