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The i.MX RT crossover MCUs combine ease of use with high-performance processing. The i.MX RT series offers many variants that propel industrial, IoT and automotive applications while delivering high levels of integration and security, with optimal power consumption. i.MX RT Crossover MCUs are supported by the MCUXpresso ecosystem, which includes an SDK, a choice of IDEs and secure provisioning and configuration tools to enable rapid development. Zephyr RTOS enablement is also available.
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| Family | CPU | Memory | Differentiated Features | Package Options | Development Board |
|---|---|---|---|---|---|
| i.MX RT1180 [1] | Arm Cortex-M7 @800 MHz | 1.5 MB SRAM | Integrated Gbps TSN switch and EtherCAT responder controller with multi-protocol support, advanced security with the integrated EdgeLock® Secure Enclave. | 289 BGA | |
| Arm Cortex-M33 @240 MHz | 144 BGA | ||||
| i.MX RT1170 | Arm Cortex-M7 @1 GHz | 2 MB SRAM | Advanced 2D graphics, MIPI-CSI, MIPI-DSI, 3x Ethernet up to Gbps with TSN/AVB, UART, SPI, I2C, USB and 3x CAN-FD, advanced embedded security with secure boot and crypto engines | 289 BGA | i.MX RT1170 Evaluation Kit |
| Arm Cortex-M4 @400 MHz | |||||
| i.MX RT1160 | Arm Cortex-M7 @600 MHz | 1 MB SRAM | Advanced 2D graphics, MIPI-CSI, MIPI-DSI, 3x Ethernet up to Gbps with TSN/AVB, UART, SPI, I2C, USB and 3x CAN-FD, advanced embedded security with secure boot and crypto engines | 289 BGA | i.MX RT1160 Evaluation Kit |
| Arm Cortex-M4 @240 MHz | |||||
| i.MX RT1064 | Arm Cortex-M7 @600 MHz | 1 MB SRAM | 2D graphics accelerator, camera, 2x 10/100M Ethernet and 3x CAN, UART, SPI, I2C, USB, high-speed GPIO, CAN-FD and synchronous parallel NAND/NOR/PSRAM controller | 196 BGA | i.MX RT1064 Evaluation Kit |
| 4 MB Flash | |||||
| i.MX RT1060 | Arm Cortex-M7 @600 MHz | 1 MB SRAM | 2D graphics accelerator, camera, 2x 10/100M Ethernet and 3x CAN, UART, SPI, I2C, USB, high-speed GPIO, CAN-FD and synchronous parallel NAND/NOR/SDRAM controller, additional package flexibility and extended temperature range to 125°C | 196 BGA, 225 BGA | i.MX RT1060 Evaluation Kit |
| i.MX RT1050 | Arm Cortex-M7 @600 MHz | 512 kB SRAM | 2D graphics accelerator, camera, 1x 10/100M Ethernet and 2x CAN, UART, SPI, I2C, USB, high-speed GPIO, CAN-FD and synchronous parallel NAND/NOR/SDRAM controller | 196 BGA | i.MX RT1050 Evaluation Kit |
| i.MX RT1040 | Arm Cortex-M7 @600 MHz | 512 kB SRAM | 2D graphics accelerator, UART, SPI, I2C, USB, CAN, package flexibility, extended temperature range up to 125°C | 169 BGA | i.MX RT1040 Evaluation Kit |
| i.MX RT1024 | Arm Cortex-M7 @500 MHz | 256 kB SRAM | 256 KB on-chip RAM can be configured as TCM or general purpose, UART, SPI, I2C, USB, CAN, 144 LQFP packages for low-cost PCB designs | 144 LQFP | i.MX RT1024 Evaluation Kit |
| 4 MB Flash | |||||
| i.MX RT1020 | Arm Cortex-M7 @500 MHz | 256 kB SRAM | 256 KB on-chip RAM can be configured as TCM or general purpose, UART, SPI, I2C, USB, 10/100M Ethernet, CAN, 144 and 100 LQFP packages for low-cost PCB designs | 100 LQFP, 144 LQFP | i.MX RT1020 Evaluation Kit |
| i.MX RT1015 | Arm Cortex-M7 @500 MHz | 128 kB SRAM | 128 KB on-chip RAM can be configured as TCM or general purpose, UART, SPI, I2C, USB, 100 LQFP packages for low-cost PCB designs | 100 LQFP | i.MX RT1015 Evaluation Kit |
| i.MX RT1010 | Arm Cortex-M7 @500 MHz | 128 kB SRAM | 128 KB on-chip RAM can be configured as TCM or general purpose, UART, SPI, I2C, USB, 80 LQFP packages for low-cost PCB designs | 80 LQFP | i.MX RT1010 Evaluation Kit |
| i.MX RT700 | Compute Subsystem Arm Cortex-M33 @325 MHz + Cadence® Tensilica® HiFi 4 @325 MHz |
Up to 7.5 MB SRAM | Features up to five computing cores including a primary Arm®
Cortex®-M33 and HiFi 4 DSP for DSP and audio processing. It
includes the first instantiation of the eIQ® Neutron NPU in a crossover MCU for machine learning
applications. An
ultra-low power Sense Subsystem with a second Cortex-M33 and HiFi 1 DSP removes the need for an
external sensor hub
reducing system design complexity, footprint and BOM costs. Designed to power smart AI-enabled edge devices such as wearables, consumer medical, smart home and HMI devices |
256 WLCSP, 324 FOWLP | Preproduction Product |
| Sense Subsystem Arm Cortex-M33 @250 MHz + Cadence® Tensilica® HiFi 1 @250 MHz |
|||||
| i.MX RT600 | Arm Cortex-M33 @300 MHz |
4.5 MB SRAM | Designed for audio, voice and consumer IoT applications - rich set of peripherals, embedded security and low power consumption, 2 port 32KB FlexSPI cache | 176 BGA, 249 FOWLP, 114 CSP | i.MX RT600 Evaluation Kit |
| Cadence® Tensilica® HiFi 4 @600 MHz | i.MX RT600 Audio Evaluation Kit | ||||
| i.MX RT500 | Arm Cortex-M33 @275 MHz + Cadence® Tensilica® Fusion F1 @275 MHz | Up to 5 MB SRAM | Designed for low power wearable and consumer IoT applications - rich set of peripherals, embedded security and very low power consumption, 2x 32 KB FlexSPI cache | 249 FOWLP | i.MX RT595 Evaluation Kit |
1. Specifications and information herein are subject to change without notice. For additional information contact support or your sales representative.
Dive into the innovative world of crossover microcontrollers. Learn how the i.MX RT Series seamlessly combines the best of microcontrollers and processors, giving you exceptional flexibility and speed for your project development.
NXP EdgeReady MCU-based turnkey solutions leverage the i.MX RT Crossover MCUs, enabling developers to quickly and easily add Alexa built-in, local voice commands and face recognition capabilities to their RTOS-based IoT products.
The new i.MX RT1180 crossover MCU includes a Gb time-sensitive networking (TSN) switch enabling real-time networking integration via real-time ethernet protocols, handling both time-sensitive and industrial real-time communication.
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A crossover MCU blends the design simplicity of a microcontroller with the performance of an applications processor. Using a microcontroller class CPU core such as an Arm Cortex-M or Cortex-M33 running at speeds of up to 1GHz, users can benefit from being able to run bare-metal or with a real-time operating system (RTOS).
Via the combination of fast code execution from internal tightly coupled memories (TCM) and the ability to directly access peripherals and interrupts without additional operating system overhead. The i.MX RT crossover parts can simultaneously run a sophisticated RTOS such as Zephyr while maintaining real-time processor and IO requirements. Users benefit from being able to get the “best of both worlds”.
Moving the flash memory external to the part means that customers can select from a large variety of components in the marketplace that are suited to their application requirements. Users get the flexibility of sourcing flash from multiple vendors while being able to tailor capacity to application requirements and cost targets.
The i.MX RT Crossover MCUs can execute in place (XIP) from an external flash or use the external flash as storage to copy code into RAM. It is even possible to boot from media such as an SD card. The FlexSPI interface allows for a variety of devices and interfaces such as single, quad, or octal DDR modes. There are also options for adding additional boot recovery sources to ensure that products always can reliably boot and implement robust OTA update mechanisms.
The i.MX RT crossover MCUs have cache memories and memory protection. This means executing from external flash does not mean a drop in performance.
For devices such as the RT10xx, there is a traditional external memory controller (EMC) for adding commodity SDRAM. The EVK’s for the RT1020, RT1040, RT1050, RT1060 and RT1170 demonstrates how to add memory via the EMC.
It is also possible to add extra memory via the FlexSPI ports. There are options for PSRAM that have a quad or Octal DDR interface. You can see an example of this on the RT685 and RT595 EVKs. It is even possible to add memory with a simple 4-bit interface for simpler PCB designs.
The i.MX RT family is supported by all the major RTOS’s such as FreeRTOS and Zephyr. The MCUXpresso SDK includes several FreeRTOS examples. NXP actively contributes to the Zephyr community and is a founding/platinum member. All the i.MX RT EVKs have board support packages in the Zephyr source tree, which are actively maintained.
The i.MX RT crossover MCUs implement all the typical peripherals that you would come to expect, such as CAN, SPI, I2C and Ethernet. Some of the i.MX RT family have peripheral features that are unique. Some of the parts have MIPI display interfaces with 2.5D graphics acceleration for more sophisticated HMI interfaces. The i.MX RT600 is an audio focused part with large on-chip SRAM, supporting up to 8 digital microphones, a large number of I2S interfaces and even has a 600MHz HiFi4 DSP co-processor. The RT10xx implements two high-speed USB ports for interesting USB use cases. Another unique peripheral is the internal peripheral crossbar (XBAR). It enables sophisticated chaining of peripheral functions to offload complex IO operations with minimal CPU intervention.
The i.MX RT crossover MCUs support the latest interface standards with the RT500, RT600 and RT1180 implementing a MIPI I3C interface. The FlexIO can be used to create various unique serial or parallel interfaces, like, for example, a camera interface or display interface.
The i.MX RT Series overview brochure featuring key families, feature, benefits and applications.
Read the brochurei.MX RT series of crossover MCUs push the boundaries of what's possible in the IoT. Connect with your world with ease.
View the infographicOur experts at NXP share insights into the enormous potential of edge computing in the next era of the IoT. Learn more in our ebook.
Sign in to read the ebookDiscover five key factors developers need to consider when choosing the right processing solution for their edge ML projects in this whitepaper from ABI Research.
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