High-Voltage USB PD Power Switch | NXP Semiconductors

High-Voltage USB PD Power Switch

Block Diagram

NX20P5090

NX20P5090 Block Diagram

Features

Key Features

  • All time two level reverse-current protection
  • 29 V tolerance on both VBUS and VINT pin
  • Wide supply voltage range from 2.5 V to 20.0 V
  • ISW maximum 5 A continuous current
  • 30 mΩ (typical) Low ON resistance
  • Default 23 V OVLO threshold and adjustable by external resistor
  • Built in Slew rate control for inrush current limit
  • Active Low EN pin with built-in pull down resistor
  • Open-drain ACK pin for power good indication
  • Over-Temperature Protection
  • Over-Voltage Lockout
  • Under-voltage Lockout
  • Reverse Current Protection
  • Surge protection: IEC61000-4-5 exceeds ±80 V on VBUS
  • IEC61000-4-2 contact discharge exceeds 8 kV on VBUS
  • HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
  • CDM AEC standard Q100-01 (JESD22-C101E)
  • Specified from -40 °C to +85 °C

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N true 0 PSPNX20P5090UKen 3 Application Note Application Note t789 2 Data Sheet Data Sheet t520 1 en_US en_US en Data Sheet Data Sheet 1 1 1.0 English 1476506359037712315238 PSP 1.1 MB None None documents None 1476506359037712315238 /docs/en/data-sheet/NX20P5090.pdf 1078000 /docs/en/data-sheet/NX20P5090.pdf NX20P5090 documents N N 2016-10-14 High Voltage USB PD Power Switch /docs/en/data-sheet/NX20P5090.pdf /docs/en/data-sheet/NX20P5090.pdf Data Sheet N 980000996212993340 Y 2022-12-07 PDF en Oct 14, 2016 980000996212993340 Data Sheet 1.1 MB N /docs/en/data-sheet/NX20P5090.pdf High Voltage USB PD Power Switch Application Note Application Note 2 2 9.0 English This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. 1442088844452695860837 PSP 3.5 MB Registration without Disclaimer None documents Extended 1442088844452695860837 /secured/assets/documents/en/application-note/AN10439.pdf 3465258 /secured/assets/documents/en/application-note/AN10439.pdf AN10439 documents Y N 2016-10-08 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /webapp/Download?colCode=AN10439 /secured/assets/documents/en/application-note/AN10439.pdf Application Note N 645036621402383989 2024-04-23 pdf Y en Jan 27, 2022 645036621402383989 Application Note Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note PDF 3 NX20P3483UK,NX20P5090UK,NX5P3090UK,NX5P3201CUK,NX5P3290UK 1 English NXP provides load switch products for USB Type C/PD and general power distribution applications. The product family includes sink switches with OVP, source switches with OCP, and combo switches. This application note offers layout guideline recommendations, allowing the use of non-HDI PCBs while benefiting from ultra small 0.4mm and 0.5mm pitch WLCSP packages. 1523392898106724527591 PSP 1.4 MB None None documents None 1523392898106724527591 /docs/en/application-note/AN12153_1.pdf 1409996 /docs/en/application-note/AN12153_1.pdf AN12153_1 documents N N 2018-04-10 AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages /docs/en/application-note/AN12153_1.pdf /docs/en/application-note/AN12153_1.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Apr 9, 2018 645036621402383989 Application Note Y N AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages true 0 NX20P5090UK downloads en true 1 Y PSP Y Y Application Note 2 /secured/assets/documents/en/application-note/AN10439.pdf 2016-10-08 1442088844452695860837 PSP 2 Jan 27, 2022 Application Note This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. PDF Registration without Disclaimer /secured/assets/documents/en/application-note/AN10439.pdf English documents 3465258 None 645036621402383989 2024-04-23 Y /webapp/Download?colCode=AN10439 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /secured/assets/documents/en/application-note/AN10439.pdf documents 645036621402383989 Application Note N en Extended Y pdf 9.0 Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note 3.5 MB AN10439 N 1442088844452695860837 /docs/en/application-note/AN12153_1.pdf 2018-04-10 1523392898106724527591 PSP 3 Apr 9, 2018 Application Note NXP provides load switch products for USB Type C/PD and general power distribution applications. The product family includes sink switches with OVP, source switches with OCP, and combo switches. This application note offers layout guideline recommendations, allowing the use of non-HDI PCBs while benefiting from ultra small 0.4mm and 0.5mm pitch WLCSP packages. None /docs/en/application-note/AN12153_1.pdf English documents 1409996 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN12153_1.pdf AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages /docs/en/application-note/AN12153_1.pdf documents 645036621402383989 Application Note N en None Y pdf 1 N N AN12153 - Non-HDI PCB load switch layout guidelines for WLCSP packages 1.4 MB NX20P3483UK,NX20P5090UK,NX5P3090UK,NX5P3201CUK,NX5P3290UK AN12153_1 N 1523392898106724527591 Data Sheet 1 /docs/en/data-sheet/NX20P5090.pdf 2016-10-14 1476506359037712315238 PSP 1 Oct 14, 2016 Data Sheet None /docs/en/data-sheet/NX20P5090.pdf English documents 1078000 None 980000996212993340 2022-12-07 /docs/en/data-sheet/NX20P5090.pdf High Voltage USB PD Power Switch /docs/en/data-sheet/NX20P5090.pdf documents 980000996212993340 Data Sheet N en None N PDF 1.0 N High Voltage USB PD Power Switch Y 1.1 MB 1.1 MB NX20P5090 N /docs/en/data-sheet/NX20P5090.pdf 1476506359037712315238 true Y Products

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3 documents

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