High-voltage back-to-back OVP switch with current sense | NXP Semiconductors

High-Voltage Back-to-Back OVP Switch with Current Sense

Block Diagram

NX30P0121UK Block diagram

NX30P0121UK Block diagram

Features

  • Wide supply voltage range from 2.5 V to 20 V
  • Switch maximum 3 A continuous current
  • 29 V tolerance on both VIN and VOUT pin
  • 54 mΩ (typical) Low ON resistance
  • Adjustable overvoltage protection threshold, internal 14.5 V VOUT OVLO
  • Built-in slew rate control for inrush current limit
  • ISNS to monitor input current from VIN to VOUT
  • Protection circuitry – Over-temperature protection – Overvoltage Protection – UnderVoltage LockOut
  • ESD protection – HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV – CDM (JESD22-C101E)
  • Specified from -40°C to +85°C

Buy/Parametrics










































































































N true 0 PSPNX30P0121UKen 3 Application Note Application Note t789 1 Data Sheet Data Sheet t520 1 Fact Sheet Fact Sheet t523 1 en_US en_US en Data Sheet Data Sheet 1 1 1.0 English The NX30P0121UK is an advanced 3A unidirectional power switch. It includes Undervoltage Lockout (UVLO), Overvoltage Lockout (OVLO) in VOUT, OVLO adjustable pin and over-temperature protection circuits. 1562168299154727100418 PSP 489.0 KB None None documents None 1562168299154727100418 /docs/en/data-sheet/NX30P0121UK.pdf 489043 /docs/en/data-sheet/NX30P0121UK.pdf NX30P0121UK documents N N 2019-07-03 High-voltage back-to-back OVP switch /docs/en/data-sheet/NX30P0121UK.pdf /docs/en/data-sheet/NX30P0121UK.pdf Data Sheet N 980000996212993340 2022-12-07 pdf N en Jun 19, 2019 980000996212993340 Data Sheet Y N High-voltage back-to-back OVP switch Application Note Application Note 1 2 9.0 English This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. 1442088844452695860837 PSP 3.5 MB Registration without Disclaimer None documents Extended 1442088844452695860837 /secured/assets/documents/en/application-note/AN10439.pdf 3465258 /secured/assets/documents/en/application-note/AN10439.pdf AN10439 documents Y N 2016-10-08 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /webapp/Download?colCode=AN10439 /secured/assets/documents/en/application-note/AN10439.pdf Application Note N 645036621402383989 2024-04-23 pdf Y en Jan 27, 2022 645036621402383989 Application Note Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note PDF Fact Sheet Fact Sheet 1 3 0 English Current-sensing output and integration protection features make the NXP 3 A, 29 V back-to-back power switch an ideal choice for portable devices with demanding power needs and limited space. 1566235972615707847079 PSP 256.0 KB None None documents None 1566235972615707847079 /docs/en/fact-sheet/NX30P0121FS.pdf 255969 /docs/en/fact-sheet/NX30P0121FS.pdf NX30P0121FS documents N N 2019-08-19 NX30P0121UK High-Voltage Power Switch /docs/en/fact-sheet/NX30P0121FS.pdf /docs/en/fact-sheet/NX30P0121FS.pdf Fact Sheet N 736675474163315314 2022-12-07 pdf N en Aug 16, 2019 736675474163315314 Fact Sheet Y N NX30P0121UK High-Voltage Power Switch false 0 NX30P0121UK downloads en true 1 Y PSP Y Y Application Note 1 /secured/assets/documents/en/application-note/AN10439.pdf 2016-10-08 1442088844452695860837 PSP 2 Jan 27, 2022 Application Note This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. PDF Registration without Disclaimer /secured/assets/documents/en/application-note/AN10439.pdf English documents 3465258 None 645036621402383989 2024-04-23 Y /webapp/Download?colCode=AN10439 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /secured/assets/documents/en/application-note/AN10439.pdf documents 645036621402383989 Application Note N en Extended Y pdf 9.0 Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note 3.5 MB AN10439 N 1442088844452695860837 Data Sheet 1 /docs/en/data-sheet/NX30P0121UK.pdf 2019-07-03 1562168299154727100418 PSP 1 Jun 19, 2019 Data Sheet The NX30P0121UK is an advanced 3A unidirectional power switch. It includes Undervoltage Lockout (UVLO), Overvoltage Lockout (OVLO) in VOUT, OVLO adjustable pin and over-temperature protection circuits. None /docs/en/data-sheet/NX30P0121UK.pdf English documents 489043 None 980000996212993340 2022-12-07 N /docs/en/data-sheet/NX30P0121UK.pdf High-voltage back-to-back OVP switch /docs/en/data-sheet/NX30P0121UK.pdf documents 980000996212993340 Data Sheet N en None Y pdf 1.0 N N High-voltage back-to-back OVP switch 489.0 KB NX30P0121UK N 1562168299154727100418 Fact Sheet 1 /docs/en/fact-sheet/NX30P0121FS.pdf 2019-08-19 1566235972615707847079 PSP 3 Aug 16, 2019 Fact Sheet Current-sensing output and integration protection features make the NXP 3 A, 29 V back-to-back power switch an ideal choice for portable devices with demanding power needs and limited space. None /docs/en/fact-sheet/NX30P0121FS.pdf English documents 255969 None 736675474163315314 2022-12-07 N /docs/en/fact-sheet/NX30P0121FS.pdf NX30P0121UK High-Voltage Power Switch /docs/en/fact-sheet/NX30P0121FS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 0 N N NX30P0121UK High-Voltage Power Switch 256.0 KB NX30P0121FS N 1566235972615707847079 true Y Products

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