1x1 Dual-band Wi-Fi® 5 (802.11ac) and Bluetooth®5.2 Combo Solution
2.4/5 GHz Dual-band 1x1 Wi-Fi® 6 (802.11ax) + Bluetooth® 5.4 Solution
The IW611 is a highly integrated 2.4/5 GHz dual-band 1x1 Wi-Fi 6 and Bluetooth/Bluetooth Low Energy 5.4 single-chip solution optimized for a broad array of IoT and Industrial applications in smart home, smart devices and accessories, smart appliances, smart energy, industrial automation, gateways and many more. This high degree of integration contributes to very low system costs and a minimum external BOM while achieving efficient co-existence between all internal radios as well as external radios, such as LTE.
IW611 includes a full-feature Wi-Fi subsystem powered by NXP’s 802.11ax (Wi-Fi 6) technology bringing higher throughput, better network efficiency, lower latency and improved range over previous generation Wi-Fi standards. The Wi-Fi subsystem integrates a Wi-Fi MAC, baseband, and direct-conversion radio with integrated PA, LNA, and transmit/receive switch removing the need for an RF front end module (FEMs) saving cost and reducing system complexity.
In addition to a Wi-Fi 6 radio, the IW611 integrates an independent Bluetooth 5.4 subsystem that supports Bluetooth and Bluetooth Low Energy (LE). The device features Bluetooth Profiles such as hands free (HFP), advanced audio distribution profile (A2DP) for audio streaming as well as additional profiles like dual wide band speech (WBS). For Bluetooth Low Energy, the IW611 enables 2 Mbit/s high-speed data rate, long range and extended advertising. Finally, LE Audio is supported utilizing Isochronous channels for a better overall audio experience.
The IW611 integrates dedicated CPUs and memories for both the Wi-Fi and Bluetooth subsystems which enable real time, independent protocol processing. Interfaces for connecting the IW611 to external host processors include SDIO 3.0 for Wi-Fi and UART for Bluetooth.
Wireless modules based on the NXP IW611 are offered by leading module manufacturers.
Product Details
Block Diagram
Choose a diagram:
Features
Wi-Fi Key Features
- 1x1 2.4/5 GHz, up to 80 MHz channel bandwidth
- UL/DL MU-MIMO and OFDMA
- Target Wake time, dual carrier modulation, extended range
- 802.11az accurate ranging
- WPA3 security
- SDIO 3.0 host interface
Bluetooth Key Features
- Supports Bluetooth 5.2 features
- Bluetooth 5.4 certified
- Integrated high power PA up to +20 dBm transmit power
- Full featured Bluetooth baseband
- SCO/eSCO links with hardware accelerated audio signal processing
- Bluetooth LE 2 Mbit/s, Long Range, Advertising Extensions
- LE Audio with Isochronous channels
- UART host interface
General Features
- Dedicated, independent CPUs and memories for Wi-Fi and Bluetooth
- Efficient power management system supporting deep-sleep low-power mode
- Single and dual antenna configurations
- 116-QFN and 132-WLCSP packages
- 0 to 70 °C and -40 to 85 °C operating temperature ranges
Part numbers include: IW611HN, IW611UK.
Partner Modules
Wi-Fi 6 (802.11ax) 2.4/5 GHz Dual-Band 1x1 + Bluetooth® 5.2
| Product | Wi-Fi I/F | Bluetooth I/F | Operating Temp | Antenna Type | Antenna # | Module Type | Module Size | Qualifications | Recommended Host |
|---|---|---|---|---|---|---|---|---|---|
| AW-XM553 |
SDIO | UART | 0 to 70 | Antenna pin(s) | 1 | SMD | 12 x 12 x 1.99 | CE, FCC, IC, Japan | i.MX |
| AW-XM553-I |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 12 x 12 x 1.99 | CE, FCC, IC, Japan | i.MX |
| CMP9611-2-R |
SDIO | UART | -40 to 85 | PCB-trace | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX / i.MX RT |
| CMP9611-9-R |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 12 x 12 x 2 | N/A | i.MX / i.MX RT |
| CMP9611-2C-R |
SDIO | UART | -40 to 85 | u.FL | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX / i.MX RT |
| CMP9611-1C-R |
SDIO | UART | 0 to 70 | U.FL Connector(s) | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX / i.MX RT |
| CMP9611-1-R |
SDIO | UART | 0 to 70 | PCB-trace | 1 | SMD | 16.64 x 27.8 x 3.47 | FCC IC CE | i.MX / i.MX RT |
| SPB611 |
SDIO | UART | -40 to 85 | RF Pad | 1 | SMD | 14 x 14 x 2.5 | FCC, IC, CE | i.MX |
| 453-00156R |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 11 x 11 x 1.69 | FCC, IC, CE, MIC, RCM, RoHS, UKCA, BT SIG | Hosted |
| 453-00155R |
SDIO | UART | -40 to 85 | Antenna pin(s) | 2 | SMD | 11 x 11 x 1.69 | FCC, IC, CE, MIC, RCM, RoHS, UKCA, BT SIG | Hosted |
| 453-00158R |
SDIO | UART | -40 to 85 | MHF 4 Connector(s) | 1 | SMD | 12 x 16 x 1.72 | FCC, IC, CE, MIC, RCM, RoHS, UKCA, BT SIG | Hosted |
| 453-00157R |
SDIO | UART | -40 to 85 | MHF 4 Connector(s) | 2 | SMD | 12 x 16 x 1.72 | FCC, IC, CE, MIC, RCM, RoHS, UKCA, BT SIG | Hosted |
| 453-00180R |
SDIO | UART | -40 to 85 | Integrated Chip | 1 | SMD | 12 x 16 x 1.72 | FCC, IC, CE, MIC, RCM, RoHS, UKCA, BT SIG | Hosted |
| 453-00166 |
SDIO | UART | -40 to 85 | MHF 4 Connector(s) | 1 | M.2 E-Key | 22 x 30 x 2.50 | FCC, IC, CE, MIC, RCM, RoHS, UKCA, BT SIG | Hosted |
| 453-00165 |
SDIO | UART | -40 to 85 | MHF 4 Connector(s) | 2 | M.2 E-Key | 22 x 30 x 2.50 | FCC, IC, CE, MIC, RCM, RoHS, UKCA, BT SIG | Hosted |
| LBEE5PL2DL-921 |
SDIO | UART | -40 to 85 | Antenna pin(s) | 2 | SMD | 8.8 x 7.7 x 1.3 | CE, FCC, IC, MIC (Japan) | i.MX |
| ENWF9501C1KF |
SDIO | UART | -40 to 85 | Antenna pin(s) | 1 | SMD | 15.3 x 12 x 2.5 | EU, CE RED, FCC, ISED | i.MX 6/7/8, i.MX RT |
| SX-SDMAX-2530S |
SDIO | UART | -40 to 85 | U.FL Connectors | 1 | SMD | 17.0 x 18.0 x 2.65 | FCC, ISED, CE, UKCA, MIC | i.MX |
| MAYA-W260-00B |
SDIO | UART, PCM/I2S | -40 to 85 | U.FL Connectors | 2 | SMD | 10.4 x 14.3 x 1.9 | HW qual: ISO-16750; FCC/ISED,RED/UKCA,GITEKI,NCC,KCC,ANZ,BTSIG | i.MX 6/7/8 i.MX RT |
| MAYA-W261-00B |
SDIO | UART, PCM/I2S | -40 to 85 | Antenna pin(s) | 2 | SMD | 10.4 x 14.3 x 1.9 | HW qual: ISO-16750; FCC/ISED,RED/UKCA,GITEKI,NCC,KCC,ANZ,BTSIG | i.MX 6/7/8 i.MX RT |
| MAYA-W266-00B |
SDIO | UART, PCM/I2S | -40 to 85 | Emb. Antenna / pin | 1 | SMD | 10.4 x 14.3 x 1.9 | HW qual: ISO-16750; FCC/ISED,RED/UKCA,GITEKI,NCC,KCC,ANZ,BTSIG | i.MX 6/7/8 i.MX RT |
Buy/Parametrics
|
|
|
|
|
|
|
|---|---|---|---|---|---|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Documentation
Quick reference to our documentation types.
1-5 of 21 documents
-
Application Note
RF Test Mode on Linux OS - Application note
-
Application Note
Wi-Fi Alliance Derivative Certification Process - Technical note
-
Application Note
Wi-Fi Firmware Automatic Recovery for Linux OS - Application note
-
Application Note
Bluetooth Direct Test Mode (DTM) - Application note
Design Resources
Hardware
Quick reference to our
board types.
1-5 of 13 hardware offerings
-
Embedded Board SolutionsNitrogen91 SMARCNEW
-
ModuleWKI611AA1
-
ModuleStream1832
-
ModuleSX-SDCAX-2530
-
ModuleMAYA-W2 M.2 card
Software
Quick reference to our software types.
1 software file
-
Examples and Quick Start Software
MCUXpresso Software Development Kit (SDK)
Note: For better experience, software downloads are recommended on desktop.
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
1-5 of 8 engineering services
-
Independent Design House (IDH)
Full integration Support and Customization
-
Independent Design House (IDH)
Hardware Engineering
-
Test House and Certification
Country certificationsNEW
-
Independent Design House (IDH)
Elektrobit DLE Digital Life Experience
-
Original Design Manufacturer (ODM)
Original Design Manufacturing (ODM)
To find additional partner offerings that support this product, visit our Partner Marketplace.