Advantech's EWM-W306: NXP 88W8997 M.2 1216

EWM-W306

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Advantech EWM-W306 is NXP88W8997 M.2 1216 solder down module, supporting 802.11ac and Bluetooth® 5.1 2x2 dual band. This wide range temperature module can use in medical device, handheld device, industrial application, embedded board and transportation.

Block Diagram

EWM-W306 Block Diagram

EWM-W306 Block Diagram
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Supported Devices

Processors and Microcontrollers

i.MX 8 Applications Processors

  • i.MX8MMINI: i.MX 8M Mini - Arm® Cortex®-A53, Cortex-M4, Audio, Voice, Video

Wireless Connectivity

Wi-Fi® + Bluetooth® + 802.15.4

  • 88W8997: 2.4/5 GHz Dual-Band 2x2 Wi-Fi® 5 (802.11ac) + Bluetooth® 5.3 Solution

Features

General Features

  • Wi-Fi 5 802.11a/b/g/n/ac 2T2R
  • Bluetooth 5.1
  • Interface: Wi-Fi for PCIe/SDIO and Bluetooth for UART
  • Dimension:12 mm X 16 mm x 1.85 mm(Max)
  • Form Factor: M.2 1216
  • Operating Temp: -30 ℃~ 85℃

Buy Options

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  • EWM-W306  

  • EWM-W306S01E module adopts NXP’s highly-integrated dual-band SoC 88W8997, IEEE 802.11ac/a/b/g/n 2X2 MU-MIMO WLAN and Bluetooth 5.0. Standard M.2 1216

Documentation

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