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Wire bond die; 59 bonding pads[OL-PCF8576DU_DA]
Receive the full breakdown. See the product footprint and more in the eCad file.
Universal LCD Driver for Low Multiplex Rates
The PCF8576D is a peripheral device which interfaces to almost any Liquid Crystal Display (LCD) with low multiplex rates. It generates the drive signals for any static or multiplexed LCD containing up to four backplanes and up to 40 segments. It can be easily cascaded for larger LCD applications. The PCF8576D is compatible with most microcontrollers and communicates via the two-line bidirectional I²C-bus. Communication overheads are minimized by a display RAM with auto-incremented addressing, by hardware subaddressing and by display memory switching (static and duplex drive modes).
- PCF8576DT/2 should not be used for new design-ins. Replacement part is PCF85176T/1 for industrial applications
- PCF8576DT/S400/2 should not be used for new design-ins. Replacement part is PCA85176T/Q900/1 for automotive applications
Product Details
Features
- AEC-Q100 compliant (PCF8576DT/S400/2) for automotive applications
- Single chip LCD controller and driver
- Selectable backplane drive configuration: static or 2, 3, 4 backplane multiplexing
- Selectable display bias configuration: static, 1/2, or 1/3
- Internal LCD bias generation with voltage-follower buffers
- 40 segment drives:
- Up to 20 7-segment numeric characters
- Up to 10 14-segment alphanumeric characters
- Any graphics of up to 160 elements
- 40 × 4-bit RAM for display data storage
- Auto-incremented display data loading across device subaddress boundaries
- Display memory bank switching in static and duplex drive modes
- Versatile blinking modes
- Independent supplies possible for LCD and logic voltages
- Wide power supply range: from 1.8 V to 5.5 V
- Wide logic LCD supply range:
- From 2.5 V for low-threshold LCDs
- Up to 6.5 V for high-threshold twisted nematic LCDs
- Low power consumption
- 400 kHz I²C-bus interface
- May be cascaded for large LCD applications (up to 2560 elements possible)
- No external components required
- Compatible with chip-on-glass and chip-on-board technology
- Manufactured in silicon gate CMOS process
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1-10 of 14 documents
Compact List
Application Note (5)
Brochure (2)
Data Sheet (1)
Package Information (2)
-
Wire bond die; 59 bonding pads[OL-PCF8576DU_DA]
Packing Information (1)
User Guide (2)
White Paper (1)
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