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Package Version Package Name Package Description Reference Codes Issue Date
SOT1172-1 HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2010-03-31
SOT1172-2 HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2010-07-13
SOT1172-3 HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2013-09-12
SOT1172-4 HTSSOP28 HTSSOP28, plastic, thermal enhanced thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 1 mm body TS-PDSO-G28(JEDEC 2017-06-11
SOT1331-1 HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad 2012-09-21
SOT1749-1 HTSSOP16 HTSSOP16, plastic, thermal enhanced thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body TS-PDSO-G16(JEDEC 2017-06-11
SOT527-1 HTSSOP20 plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad MO-153(JEDEC 2005-11-02
SOT527-2 HTSSOP20 HTSSOP20, plastic, thermal enhanced thin shrink small outline package; 20 terminals; 0.65 mm pitch; 4.4 mm x 6.5 mm x 0.9 mm body TS-PDSO-G28(JEDEC 2017-06-11
SOT549-1 HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2005-11-02
SOT549-3 HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2005-11-02
SOT633-3 HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 2004-01-22
SOT770-1 HTSSOP8 plastic thermal enhanced thin shrink small outline package; 8 leads; body width 3 mm; exposed die pad 2002-05-14
SOT793-1 HTSSOP56 plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad MO-153(JEDEC);143E36T(IEC 2003-03-04
SOT864-1 HTSSOP24 plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC 2005-12-06