MPC8306CVMAFDCA Product Information|NXP

Features


PowerQUICC, Power Arch SoC, 333MHz, DDR2, HDLC, TDM, Enet, USB, CAN, -40 to 105C, Rev 1.1

Package


LFBGA369: LFBGA369, plastic, low profile fine-pitch ball grid array; 369 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body

Buy Options

Operating Features

ParameterValue
Core Type
e300
Operating Frequency [Max] (MHz)
333
ParameterValue
External Memory Supported
DDR2 SDRAM, SDRAM
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MPC8306CVMAFDCA(935323176557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
1035.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MPC8306CVMAFDCA
(935323176557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MPC8306CVMAFDCA
(935323176557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MPC8306CVMAFDCA
(935323176557)
2021-05-122021-06-07202105012INXP ATTJ Final Test Site Relocation from ATTJ to ATTJ Building 2 (ATTJ-B2)
MPC8306CVMAFDCA
(935323176557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC8306CVMAFDCA
(935323176557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC8306

The MPC8306 and MPC8306S are part of the cost-effective MPC830x communications processor family based on the e300 core and built on Power Architecture® technology. The devices integrate QUICC Engine® technology capable of supporting HDLC, TDM and 10/100 R/MII. The MPC8306 also supports IEEE® 1588 v2 time stamping. The MPC8306/S devices provide users with a highly integrated, fully programmable communications processor for use in many networking, industrial control and low-end embedded applications. This helps ensure that a cost-effective system solution can be quickly developed and offers flexibility to accommodate new standards and evolving system requirements.