MCF54454VR266 Product Information|NXP

Features


MCF5445x 32-bit MPU, ColdFire V4 core, 266MHz, PBGA 360

Package


BGA360: BGA360, plastic, ball grid array; 360 balls; 1 mm pitch; 23 mm x 23 mm x 1.9 mm body

Buy Options

MCF54454VR266

End of Life

12NC: 935316957557

Details

Order

Operating Features

ParameterValue
Operating Frequency [Max] (MHz)
266
RAM (kB)
32
ParameterValue
GPIO
132
Ambient Operating Temperature (Min to Max) (℃)
0 to 70

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MCF54454VR266(935316957557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
1733.3

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MCF54454VR266
(935316957557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MCF54454VR266
(935316957557)
854231
3A991A2

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
MCF54454VR266
(935316957557)
NOTICE
2021-05-14
2021-12-31
MCF54454VP266
(935420991557)

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MCF54454VR266
(935316957557)
2021-04-242021-04-25202103047DNMCF5445X PBGA Part Number Migration due to Molding Change from Corner-Gate Mold (CGM) to Pin-Gate Mold (PGM)
MCF54454VR266
(935316957557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

More about MCF5445X

The MCF5445x family of 32-bit microprocessors feature a rich set of connectivity peripherals including Ethernet, USB on-the-go (USB OTG) and peripheral component interconnect (PCI).

Developed for power-conscious designers, the MCF5445x family is ideal for consumer and embedded control designs that need high-performance and connectivity.

These highly integrated microprocessors open the door to expanding application capabilities while driving down total system cost and power requirements.