MC17XS6500BEK Product Information|NXP

MC17XS6500BEK

No Longer Manufactured

MC17XS6500BEK

No Longer Manufactured

Buy Options

MC17XS6500BEKR2

No Longer Manufactured

12NC: 934070631518

Details

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Operating Features

ParameterValue
Device Function
high side switch
Load Current (IL) [TYP] (A)
5.5
Load Current (IL) [MAX] (A)
9
Number of Channels
5
Drain-to-Source On Resistance (Typ) (mOhm) (RDS(ON))
17
Load Supply Voltage (Min) (V)
7
ParameterValue
Load Supply Voltage (Max) (V)
18
Supply Voltage [max] (V)
5.5
Supply Voltage [min] (V)
4.5
SPI [bits]
8
Interface and Input Control
Direct from input, SPI
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC17XS6500BEKR2(934070631518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
482.8

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC17XS6500BEKR2
(934070631518)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC17XS6500BEKR2
(934070631518)
854239
EAR99

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC17XS6500BEKR2
(934070631518)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC17XS6500BEKR2
(934070631518)
2019-02-022019-05-03201901012F01eXtreme Switch MC12XS6 and MC32XSG Device Family Data Sheet Updates Proposal: Modification of Pull-up and Pull-down Resistor
MC17XS6500BEKR2
(934070631518)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MC12XS6

The NXP® 12XS6 is a 4th generation eXtreme switch for automotive lighting drivers that can control and diagnose bulbs and light emitting diodes (LEDs) with enhanced diagnostic precision.

  • Combines flexibility through daisy chainable SPI at 5.0 MHz, extended digital and analog feedbacks, safety and robustness
  • Low RDS(ON) and high integration allows power and space saving at the module level
  • Dual, triple, quad, and penta-output devices are hardware and SPI compatible
  • Packaged in a Pb-Free power-enhanced SOIC package with exposed pad, which is ELV compliant