Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
HSOP32: HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 4.6 mm x 7 mm exposed pad
Buy Options
MC17XS6400CEK
End of Life
12NC: 934071599574
Details
Order
MC17XS6400CEKR2
End of Life
12NC: 934071599518
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Number of pins | 32 |
Package Style | HSOP |
SPI [bits] | 8 |
RDSon [typ] | 0.017 |
Device Function | high side switch |
Security Status | COMPANY PUBLIC |
Supply Voltage2 [Min to Max] (V) | 7 to 18 |
Interface and Input Control | Direct from input / Direct from input, SPI / SPI |
Description | High-Side Switch, 12V, Quad 17mOhms, SOIC 32 |
Interface and Input Control | Direct from input, SPI |
Supply Voltage [Min - Max] | 4.5, 5.5 |
Diagnostics | Direct from input, SPI |
Operating Voltage [Min to Max] (V) | 4.5 to 5.5 |
| Parameter | Value |
|---|---|
Load Current (IL) [MAX] (A) | 9 |
Supply Voltage [max] (V) | 5.5 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
Supply Voltage [min] (V) | 4.5 |
Pad supply (V) | 4.5 to 5.5 |
Supply Voltage [Min to Max] (V) | 4.5 to 5.5 |
Load Current (IL) [TYP] (A) | 5.5 |
Drain-to-Source On Resistance (Typ) (mOhm) (RDS(ON)) | 17 |
Host Interface | Direct from input, SPI |
Number of Channels | 4 |
Load Supply Voltage (Min) (V) | 7 |
Operating Temperature (Min-Max) (℃) | -40 to 125 |
Load Supply Voltage (Max) (V) | 18 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MC17XS6400CEK(934071599574) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 482.8 |
MC17XS6400CEKR2(934071599518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e3 | REACH SVHC | 482.8 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Soldering | Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | |||
MC17XS6400CEK (934071599574) | No | 3 | 260 | 260 | 40 | 40 | |
MC17XS6400CEKR2 (934071599518) | No | 3 | 260 | 260 | 40 | 40 | |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
MC17XS6400CEK (934071599574) | 854239 | EAR99 |
MC17XS6400CEKR2 (934071599518) | 854239 | EAR99 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MC17XS6400CEK (934071599574) | 2025-04-16 | 2025-05-26 | 202504006I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MC17XS6400CEKR2 (934071599518) | ||||
MC17XS6400CEK (934071599574) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MC17XS6400CEKR2 (934071599518) |
More about MC12XS6
The NXP® 12XS6 is a 4th generation eXtreme switch for automotive lighting drivers that can control and diagnose bulbs and light emitting diodes (LEDs) with enhanced diagnostic precision.
- Combines flexibility through daisy chainable SPI at 5.0 MHz, extended digital and analog feedbacks, safety and robustness
- Low RDS(ON) and high integration allows power and space saving at the module level
- Dual, triple, quad, and penta-output devices are hardware and SPI compatible
- Packaged in a Pb-Free power-enhanced SOIC package with exposed pad, which is ELV compliant