MC07XS6517DEK Product Information|NXP

Features


High-Side Switch, 12V, Triple 7mOhm + Dual 17mOhm, SOICEP 54, Rail

Package


HSOP54: HSOP54, plastic, heatsink small outline package; W/B, tooth gap design, 54 terminals; 0.65 mm pitch; 4.6 mm x 10.4 mm exposed pad

Buy Options

MC07XS6517DEKR2

Active

12NC: 934072395518

Details

Order

Order from distributors

Operating Features

ParameterValue
Device Function
high side switch
Load Current (IL) [TYP] (A)
5.5, 11
Load Current (IL) [MAX] (A)
9, 18
Number of Channels
2, 3
Drain-to-Source On Resistance (Typ) (mOhm) (RDS(ON))
7, 17
Load Supply Voltage (Min) (V)
7
ParameterValue
Load Supply Voltage (Max) (V)
18
Supply Voltage [max] (V)
5.5
Supply Voltage [min] (V)
4.5
SPI [bits]
16
Interface and Input Control
Direct from input, SPI
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
MC07XS6517DEK(934072395574)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
774.45
MC07XS6517DEKR2(934072395518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
774.45

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC07XS6517DEK
(934072395574)
No
3
260
40
MC07XS6517DEKR2
(934072395518)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC07XS6517DEK
(934072395574)
854239
EAR99
MC07XS6517DEKR2
(934072395518)
854239
EAR99

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC07XS6517DEK
(934072395574)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC07XS6517DEKR2
(934072395518)

More about MC12XS6

The NXP® 12XS6 is a 4th generation eXtreme switch for automotive lighting drivers that can control and diagnose bulbs and light emitting diodes (LEDs) with enhanced diagnostic precision.

  • Combines flexibility through daisy chainable SPI at 5.0 MHz, extended digital and analog feedbacks, safety and robustness
  • Low RDS(ON) and high integration allows power and space saving at the module level
  • Dual, triple, quad, and penta-output devices are hardware and SPI compatible
  • Packaged in a Pb-Free power-enhanced SOIC package with exposed pad, which is ELV compliant