PowerQUICC® III Processor with DDR2/3 | NXP Semiconductors

PowerQUICC® III Processor with DDR2/3

Block Diagram

Freescale PowerQUIICC MPC8569E Communications Processor Block Diagram

NXP<sup>&#174;</sup> PowerQUIICC MPC8569E Communications Processor Block Diagram

Features

  • Embedded e500 core, scaling up to 1.33 GHz
    • 2799 MIPS at 1.33 GHz (estimated Dhrystone 2.1)
    • 36-bit physical addressing
    • Double-precision embedded floating point
    • Memory management unit (MMU)
  • Integrated L1/L2 cache
    • L1 cache—32 KB data and 32 KB instruction
    • L2 cache—512 KB (eight-way set associative)
  • Integrated DDR memory controller with full ECC support
  • Integrated security engine supporting DES, 3DES, MD-5, SHA-1/2, AES, RSA, RNG, Kasumi F8/F9, SNOW, and ARC-4
  • QUICC engine technology
    • Four 32-bit RISC cores
  • Serial RapidIO® and PCI Express® high-speed interconnect interfaces
  • On-chip network switch fabric
  • 166 MHz, 32-bit, 3.3V I/O, enhanced local bus with memory controller
  • Enhanced secured digital host controller (eSDHC) used for SD/MMC card interface
  • Integrated four-channel DMA controller
  • Dual I²C and dual universal asynchronous receiver/transmitter (DUART) support
  • Programmable interrupt controller (PIC)
  • General purpose I/O (GPIO)
  • IEEE® 1149.1 JTAG test access port
  • 1.0V core voltage with 3.3V, 2.5V, 1.8V, 1.5V and 1.0V I/O
  • 783-pin FC-PBGA package, 29 mm x 29 mm
  • This product is included in NXP®.s product longevity program, with assured supply for a minimum of 10 years after launch
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    Buy/Parametrics

    9 results

    Exclude 9 NRND

    CAD Model

    Status

    Package Type

    Package Termination Count

    Core Type

    Operating Frequency [Max] (MHz)

    Core: Number of cores (SPEC)

    L2 Cache (Max) (KB)

    External Memory Supported

    Ambient Operating Temperature (Min to Max) (℃)

    End of Life

    BGA783

    783

    e500

    1067

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    -40 to 105

    End of Life

    BGA783

    783

    e500

    800

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    -40 to 105

    End of Life

    BGA783

    783

    e500

    1067

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    -40 to 105

    End of Life

    BGA783

    783

    e500

    800

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    0 to 105

    End of Life

    BGA783

    783

    e500

    1067

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    0 to 105

    End of Life

    BGA783

    783

    e500

    1333

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    0 to 105

    End of Life

    BGA783

    783

    e500

    800

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    0 to 105

    End of Life

    BGA783

    783

    e500

    1067

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    0 to 105

    End of Life

    BGA783

    783

    e500

    1333

    1

    256

    DDR SDRAM, DDR2 SDRAM, SDRAM

    0 to 105

    Documentation

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    Application Note (22)
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    1 design file

    Hardware

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    2 hardware offerings

    Software

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    1 software file

    Note: For better experience, software downloads are recommended on desktop.

    Engineering Services

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    Training

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