PowerQUICC® III Processor with DDR2/3

PowerQUICC® III Processor with DDR2/3 | NXP Semiconductors

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The MPC8569E PowerQUICC^® III family is designed to address the increasing performance requirements for broadband access equipment including 3G/WiMAX/LTE base stations, radio network controllers, gateways and ATM/TDM/IP equipment. The MPC8569E helps facilitate both IP and multi-protocol solutions by combining a high-performance e500 processor core, built on Power Architecture^® technology and scaling up to 1.33 GHz, with a flexible communications engine and high-speed system interfaces. The MPC8569E is designed to enable customers to handle many functions in a single-chip solution that otherwise would require multiple devices. This high level of integration provides savings in cost, power and board space.

Data Sheet

Reference Manual

Product Details

Block Diagram

Freescale PowerQUIICC MPC8569E Communications Processor Block Diagram

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Features

Embedded e500 core, scaling up to 1.33 GHz

2799 MIPS at 1.33 GHz (estimated Dhrystone 2.1)
36-bit physical addressing
Double-precision embedded floating point
Memory management unit (MMU)

Integrated L1/L2 cache

L1 cache—32 KB data and 32 KB instruction
L2 cache—512 KB (eight-way set associative)

Integrated DDR memory controller with full ECC support

Integrated security engine supporting DES, 3DES, MD-5, SHA-1/2, AES, RSA, RNG, Kasumi F8/F9, SNOW, and ARC-4

QUICC engine technology

Four 32-bit RISC cores

Serial RapidIO^{^®} and PCI Express^® high-speed interconnect interfaces

On-chip network switch fabric

166 MHz, 32-bit, 3.3V I/O, enhanced local bus with memory controller

Enhanced secured digital host controller (eSDHC) used for SD/MMC card interface

Integrated four-channel DMA controller

Dual I²C and dual universal asynchronous receiver/transmitter (DUART) support

Programmable interrupt controller (PIC)

General purpose I/O (GPIO)

IEEE^® 1149.1 JTAG test access port

1.0V core voltage with 3.3V, 2.5V, 1.8V, 1.5V and 1.0V I/O

783-pin FC-PBGA package, 29 mm x 29 mm

This product is included in NXP^®.s product longevity program, with assured supply for a minimum of 10 years after launch

Part Show description	Status	Package Type	Package Termination Count	Core Type	Operating Frequency [Max] (MHz)	Core: Number of cores (SPEC)	L2 Cache (Max) (KB)	External Memory Supported	Ambient Operating Temperature (Min to Max) (℃)
MPC8569CVJAQLJB Data Sheet	End of Life	BGA783	783	e500	1067	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	-40 to 105
MPC8569ECVJANKGB Data Sheet	End of Life	BGA783	783	e500	800	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	-40 to 105
MPC8569ECVJAQLJB Data Sheet	End of Life	BGA783	783	e500	1067	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	-40 to 105
MPC8569EVJANKGB Data Sheet	End of Life	BGA783	783	e500	800	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	0 to 105
MPC8569EVJAQLJB Data Sheet	End of Life	BGA783	783	e500	1067	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	0 to 105
MPC8569EVJAUNLB Data Sheet	End of Life	BGA783	783	e500	1333	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	0 to 105
MPC8569VJANKGB Data Sheet	End of Life	BGA783	783	e500	800	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	0 to 105
MPC8569VJAQLJB Data Sheet	End of Life	BGA783	783	e500	1067	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	0 to 105
MPC8569VJAUNLB Data Sheet	End of Life	BGA783	783	e500	1333	1	256	DDR SDRAM, DDR2 SDRAM, SDRAM	0 to 105

Design Resources

Design Files

Quick reference to our design files types.

1 design file

Printed Circuit Boards and Schematics
MPC8569E

PDFRev 1Jun 23, 20091.7 MBMPC8569E_SCHEMATICS.PDF
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