Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Buy Options
SPC5602DF1VLL3
Active
12NC: 935325927557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Flash (kB) | 256 |
RAM (kB) | 24 |
Core Type | e200 |
Core: Number of cores (SPEC) | 1 |
Operating Frequency [Max] (MHz) | 32 |
I2C | 1 |
| Parameter | Value |
|---|---|
CAN | 2 |
DSPI | 3 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Supply Voltage [min] (V) | 3 |
Supply Voltage [max] (V) | 5.5 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
SPC5602DF1VLL3(935325927557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 685.2 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
SPC5602DF1VLL3 (935325927557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
SPC5602DF1VLL3 (935325927557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SPC5602DF1VLL3 (935325927557) | 2025-04-16 | 2025-05-26 | 202504009I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
SPC5602DF1VLL3 (935325927557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SPC5602DF1VLL3 (935325927557) | 2020-10-30 | 2020-11-30 | 202007015I | NXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments |
More about MPC560xB
The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.
These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.