SPC5602BF2CLL4 Product Information|NXP

Features


Freescale 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 100

Package


LQFP100: LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body

Buy Options

Operating Features

ParameterValue
Flash (kB)
256
RAM (kB)
24
Operating Frequency [Max] (MHz)
48
I2C
1
CAN
2
SCI
3
ParameterValue
DSPI
3
GPIO
79
Ambient Operating Temperature (Min to Max) (℃)
-40 to 85
Supply Voltage [min] (V)
3
Supply Voltage [max] (V)
5.5

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
SPC5602BF2CLL4(935323114557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2
SPC5602BF2CLL4R(935323114528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SPC5602BF2CLL4
(935323114557)
No
3
260
40
SPC5602BF2CLL4R
(935323114528)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
SPC5602BF2CLL4
(935323114557)
854231
3A991A2
SPC5602BF2CLL4R
(935323114528)
854231
3A991A2

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeReplacement
SPC5602BF2CLL4
(935323114557)
-None

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5602BF2CLL4
(935323114557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5602BF2CLL4R
(935323114528)
SPC5602BF2CLL4
(935323114557)
2020-10-302020-11-30202007015INXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments
SPC5602BF2CLL4
(935323114557)
2018-01-152018-01-16201710028IMPC5604B/C Data Sheet Update to Rev 14 MPC5606B Data Sheet Update to Rev 5 and MPC5607B Data Sheet Update to Rev 9

More about MPC560xB

The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.

These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.