Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
NXP 32-bit MCU, Power Arch core, 1.5MB Flash, 64MHz, -40/+105degC, Automotive Grade, QFP 144
Package
LQFP144: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body
Buy Options
SPC5607BK0VLQ6
Active
12NC: 935315643557
Details
Order
SPC5607BK0VLQ6R
Active
12NC: 935315643528
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Flash (kB) | 1536 |
RAM (kB) | 92 |
Core Type | e200 |
Core: Number of cores (SPEC) | 1 |
| Parameter | Value |
|---|---|
Operating Frequency [Max] (MHz) | 64 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Supply Voltage [min] (V) | 3 |
Supply Voltage [max] (V) | 5.5 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
SPC5607BK0VLQ6(935315643557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 1319.1 |
SPC5607BK0VLQ6R(935315643528) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e3 | REACH SVHC | 1319.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
SPC5607BK0VLQ6 (935315643557) | No | 3 | 260 | 40 | |||
SPC5607BK0VLQ6R (935315643528) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
SPC5607BK0VLQ6 (935315643557) | 854231 | 3A991A2 |
SPC5607BK0VLQ6R (935315643528) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SPC5607BK0VLQ6 (935315643557) | 2025-04-16 | 2025-05-26 | 202504009I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
SPC5607BK0VLQ6R (935315643528) | ||||
SPC5607BK0VLQ6 (935315643557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SPC5607BK0VLQ6R (935315643528) | ||||
SPC5607BK0VLQ6 (935315643557) | 2018-01-15 | 2018-01-16 | 201710028I | MPC5604B/C Data Sheet Update to Rev 14 MPC5606B Data Sheet Update to Rev 5 and MPC5607B Data Sheet Update to Rev 9 |
SPC5607BK0VLQ6R (935315643528) |
More about MPC560xB
The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.
These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.