Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
NXP 32-bit MCU, Power Arch core, 1MB Flash, 48MHz, -40/+85degC, Automotive Grade, QFP 176
Package
LQFP176: LQFP176, plastic, low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body
Buy Options
SPC5606BK0CLU4
Active
12NC: 935321933557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Flash (kB) | 1024 |
RAM (kB) | 80 |
Operating Frequency [Max] (MHz) | 48 |
| Parameter | Value |
|---|---|
Ambient Operating Temperature (Min to Max) (℃) | -40 to 85 |
Supply Voltage [min] (V) | 3 |
Supply Voltage [max] (V) | 5.5 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
SPC5606BK0CLU4(935321933557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 1868.5 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
SPC5606BK0CLU4 (935321933557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
SPC5606BK0CLU4 (935321933557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
SPC5606BK0CLU4 (935321933557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
SPC5606BK0CLU4 (935321933557) | 2018-01-15 | 2018-01-16 | 201710028I | MPC5604B/C Data Sheet Update to Rev 14 MPC5606B Data Sheet Update to Rev 5 and MPC5607B Data Sheet Update to Rev 9 |
More about MPC560xB
The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.
These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.