SPC5602DF1MLH4 Product Information|NXP

Features


NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 64

Package


LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body

Buy Options

SPC5602DF1MLH4

Active

12NC: 935311786557

Details

Order

In Stock:765
Order from distributors

Operating Features

ParameterValue
Flash (kB)
256
RAM (kB)
16
Core Type
e200
Core: Number of cores (SPEC)
1
Operating Frequency [Max] (MHz)
48
CAN
1
ParameterValue
SCI
3
DSPI
2
GPIO
45
Ambient Operating Temperature (Min to Max) (℃)
-40 to 125
Supply Voltage [min] (V)
3
Supply Voltage [max] (V)
5.5

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
SPC5602DF1MLH4(935311786557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
363.6
SPC5602DF1MLH4R(935311786528)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
363.6

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
SPC5602DF1MLH4
(935311786557)
No
3
260
40
SPC5602DF1MLH4R
(935311786528)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
SPC5602DF1MLH4
(935311786557)
854231
3A991A2
SPC5602DF1MLH4R
(935311786528)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
SPC5602DF1MLH4
(935311786557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SPC5602DF1MLH4R
(935311786528)
SPC5602DF1MLH4
(935311786557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5602DF1MLH4R
(935311786528)
SPC5602DF1MLH4R
(935311786528)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC560xB

The MPC560xB/C/D family of 32-bit MCUs includes the latest in integrated devices for automotive body electronics and industrial applications.

These scalable Power Architecture® technology-based devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly execute your designs.