Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
BGA783: BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.75 mm body
Buy Options
MPC8555EPXAQF
End of Life
12NC: 935309503557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
External Memory Supported | DDR SDRAM, SDRAM, SRAM |
Environmental
| Part/12NC | PbFree | EU RoHS | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
MPC8555EPXAQF(935309503557) | No | No |  | e0 | REACH SVHC | 4311.3 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Soldering | Lead Soldering | Lead Soldering | |||||
MPC8555EPXAQF (935309503557) | No | 3 | 245 | 30 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | CCATS |
|---|---|---|---|
MPC8555EPXAQF (935309503557) | 854231 | 5A002A1 | G145399 |
Discontinued and Replacement Part Data
| Part/12NC | Discontinuance Notice | Last Time Buy Date | Last Time Delivery Date | Replacement |
|---|---|---|---|---|
MPC8555EPXAQF (935309503557) | - | - | - | MPC8555EVTAQF (935316695557) |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MPC8555EPXAQF (935309503557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MPC8555EPXAQF (935309503557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MPC8555EPXAQF (935309503557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
More about MPC8555E
Our MPC8555E PowerQUICC® III host processor integrates a wide range of advanced NXP® technologies, modular cores and peripherals. Leveraging Our system-on-chip (SoC) PowerQUICC III platform architecture, the MPC8555E combines the powerful e500 core and communications peripheral technology to balance processor performance with I/O system throughput. The processor is designed to offer clock speeds scaling from 533 MHz to 1 GHz.
Access to the errata document for this device requires an NDA. Contact your local NXP Sales Office or NXP Authorized Distributor.