Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
FBGA529: FBGA529, plastic, fine-pitch ball grid array; 529 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.64 mm body
Buy Options
MCIMX537CVV8C
End of Life
12NC: 935319782557
Details
Order
MCIMX537CVV8CR2
End of Life
12NC: 935319782518
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Core Type | 1 x Arm Cortex-A8 |
Operating Frequency [Max] (MHz) | 800 |
L2 Cache (Max) (KB) | 256 |
| Parameter | Value |
|---|---|
Serial Communication | 1 x I²C, 3 x SPI, 5 x UART |
CAN | 1 |
Ethernet | 1 x 10/100 BaseT |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MCIMX537CVV8C(935319782557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 2136.1 |
MCIMX537CVV8CR2(935319782518) | Yes | Yes Certificate Of Analysis (CoA) | Yes | | e2 | REACH SVHC | 2136.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MCIMX537CVV8C (935319782557) | No | 3 | 260 | 40 | |||
MCIMX537CVV8CR2 (935319782518) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | CCATS |
|---|---|---|---|
MCIMX537CVV8C (935319782557) | 854231 | 5A992C | G166378 |
MCIMX537CVV8CR2 (935319782518) | 854231 | 5A992C | G166378 |
Discontinued and Replacement Part Data
| Part/12NC | Discontinuance Notice | Last Time Buy Date | Last Time Delivery Date | Replacement |
|---|---|---|---|---|
MCIMX537CVV8C (935319782557) | NOTICE | 2021-02-15 | 2021-06-15 | MCIMX537CVP8C2 (935420974557) |
MCIMX537CVV8CR2 (935319782518) | NOTICE | 2021-02-15 | 2021-06-15 | MCIMX537CVP8C2R2 (935420974518) |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MCIMX537CVV8C (935319782557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MCIMX537CVV8CR2 (935319782518) | ||||
MCIMX537CVV8C (935319782557) | 2021-02-20 | 2021-02-21 | 202102018DN | Non-Auto i.MX53 PBGA Part Number Migration due to Molding Change from Corner-Gate Mold (CGM) to Pin-Gate Mold (PGM) |
MCIMX537CVV8CR2 (935319782518) | ||||
MCIMX537CVV8C (935319782557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MCIMX537CVV8CR2 (935319782518) | ||||
MCIMX537CVV8C (935319782557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
MCIMX537CVV8CR2 (935319782518) |
More about i.MX537
The i.MX53 family of processors represents NXP’s next generation of advanced multimedia and power-efficient implementation of the Arm® Cortex®-A8 core. With core processing speeds up to 800 MHz, the i.MX537 is optimized for both performance and power to meet the demands of high-end, advanced applications. Integrated display controller, 1080p HD video decode and 720p video encode, enhanced graphics and connectivity features make the i.MX537 ideal for a wide range of applications such as Human Machine Interfaces (HMI) and patient monitors which require rich user interfaces with high color displays and user interaction.
The i.MX537 provides key environmental differentiators for the industrial market. These include 3.3V I/O support, a 0.8 mm pitch package to reduce PCB and manufacturing costs, extended temperature coverage for harsh environments, industrial qualification for extended reliability and a formal long product supply guarantee to support product life spans.
The i.MX537 is supported by a companion NXP power management IC (PMIC), MC34709.