MPC8543ECVJAQGD Product Information|NXP

Buy Options

MPC8543ECVJAQGD

End of Life

12NC: 935320281557

Details

Order

Operating Features

ParameterValue
Security Status
COMPANY PUBLIC
Description
FG PQ38 8543 Rev 3 Lead-free
ParameterValue
Number of pins
783
Package Style
BGA

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MPC8543ECVJAQGD(935320281557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
7994.4

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MPC8543ECVJAQGD
(935320281557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)CCATS
MPC8543ECVJAQGD
(935320281557)
854231
5A002A1
G145398

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
MPC8543ECVJAQGD
(935320281557)
NOTICE
2021-09-09
2022-09-09
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MPC8543ECVJAQGD
(935320281557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MPC8543ECVJAQGD
(935320281557)
2021-03-042021-03-05202102034DNDiscontinuance of P1010P1020 P1022 P2020P3041 P4080 P5040 C290 MSC8156 BSC9131837x 8548 8572 8536 8544 Families
MPC8543ECVJAQGD
(935320281557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MPC8543ECVJAQGD
(935320281557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MPC8543E

NXP has developed four next-generation PowerQUICC™ III processors based on the scalable e500 system-on-chip (SoC) platform and Power Architecture processor core. These PowerQUICC® III processors, the MPC8548E, MPC8547E, MPC8545E and MP8543E, are designed to deliver gigahertz-plus communications processing performance and advanced features with the exceptional integration and high-speed connectivity required by enterprise networking, telecom transmission and switching, 3G wireless infrastructure, storage and high-end imaging markets.. The processors are designed to offer clock speeds scaling up to 1.5 GHz. They combine the powerful processor core, enhanced peripherals and high-speed interconnect technology to balance processor performance with I/O system throughput.

The next-generation PowerQUICC III processors are based on NXP®.s 90 nanometer (nm) silicon-on-insulator (SOI) copper interconnect process technology, which enables processors to deliver higher performance with lower power dissipation. At 1.5 GHz, these new processors deliver a significant performance increase over current 130 nm PowerQUICC III devices.

The MPC8548E, MPC8547E, MPC8545E and MP8543/E processors offer a wide range of high-speed connectivity options, including Gigabit Ethernet, Serial RapidIO® technology and PCI Express. Support for these high-speed interfaces enables scalable connectivity to network processors and/or ASICs in the data plane while the PowerQUICC III handles complex, computationally demanding control plane processing tasks. These processors also feature next-generation double data rate (DDRII) memory controller, enhanced, Gigabit Ethernet support, double precision floating point and integrated security engines that support the Kasumi alogrithm needed for 3G wireless security. In addition, support is provided for XOR acceleration needed for parity in storage applications.