Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
Kinetis K60: 100MHz Cortex-M4 MCU, 512KB Flash, 64KB SRAM, Full-Speed USB, Ethernet, 144-LQFP
Package
LQFP144: LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body
Buy Options
MK60DX256ZVLQ10
NRND
12NC: 935325601557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Security Status | COMPANY PUBLIC |
Description | Kinetis K60: 100MHz Cortex-M4 MCU, 512KB Flash, 64KB SRAM, Full-Speed USB, Ethernet, 144-LQFP |
| Parameter | Value |
|---|---|
Number of pins | 144 |
Package Style | LQFP |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MK60DX256ZVLQ10(935325601557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e3 | REACH SVHC | 1319.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MK60DX256ZVLQ10 (935325601557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | Footprint | Capture Symbol |
|---|---|---|---|---|
MK60DX256ZVLQ10 (935325601557) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MK60DX256ZVLQ10 (935325601557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
More about K60_100
The Kinetis® K60 100 MHz IEEE® 1588 Ethernet MCUs are built on the Arm® Cortex®-M4 core and feature advanced analog integration and serial communication. Available down to a 5 mm x 5 mm wafer-level chip-scale package (WLCSP), these devices maximize board space and enhance performance with minimum-length interconnections, allowing the miniaturization of existing applications. This family shares the comprehensive enablement and scalability of the Kinetis portfolio.