Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
Kinetis® K60-100 MHz, Mixed-Signal Integration Microcontrollers based on Arm® Cortex®-M4 Core
Package
LBGA144: LBGA144; plastic, low profile ball grid array; 144 balls; 1.0 mm pitch; 13 mm x 13 mm x 1.7 mm body
Buy Options
MK60DN256VMD10
Active
12NC: 935321762557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Core Type | Arm Cortex-M4 |
Operating Frequency [Max] (MHz) | 100 |
SRAM (kB) | 64 |
Flash (kB) | 256 |
UART | 6 |
SPI | 3 |
I2C | 2 |
USB Controllers | 1 |
| Parameter | Value |
|---|---|
CAN | 2 |
GPIO | 100 |
ADC (16 bit) | 2 |
16-bit PWM | 12 |
Security | CA, CRC, RNG |
Supply Voltage [min] (V) | 1.71 |
Supply Voltage [max] (V) | 3.6 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MK60DN256VMD10(935321762557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 441.0 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MK60DN256VMD10 (935321762557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | Footprint | Capture Symbol |
|---|---|---|---|---|
MK60DN256VMD10 (935321762557) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MK60DN256VMD10 (935321762557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MK60DN256VMD10 (935321762557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MK60DN256VMD10 (935321762557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
More about K60_100
The Kinetis® K60 100 MHz IEEE® 1588 Ethernet MCUs are built on the Arm® Cortex®-M4 core and feature advanced analog integration and serial communication. Available down to a 5 mm x 5 mm wafer-level chip-scale package (WLCSP), these devices maximize board space and enhance performance with minimum-length interconnections, allowing the miniaturization of existing applications. This family shares the comprehensive enablement and scalability of the Kinetis portfolio.