Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
Kinetis® K22-120 MHz, Cost Effective, Full-Speed USB Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core
Package
LFBGA121: LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.38 mm body
Buy Options
MK22FN1M0AVMC12
Active
12NC: 935318639557
Details
Operating Features
| Parameter | Value |
|---|---|
Core Type | Arm Cortex-M4 |
Operating Frequency [Max] (MHz) | 120 |
SRAM (kB) | 128 |
Flash (kB) | 1024 |
UART | 6 |
SPI | 3 |
I2C | 3 |
USB Controllers | 1 |
| Parameter | Value |
|---|---|
CAN | 1 |
GPIO | 86 |
ADC (16 bit) | 2 |
16-bit PWM | 20 |
Security | CRC |
Supply Voltage [min] (V) | 1.71 |
Supply Voltage [max] (V) | 3.6 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 105 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MK22FN1M0AVMC12(935318639557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 167.7 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MK22FN1M0AVMC12 (935318639557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
MK22FN1M0AVMC12 (935318639557) | 854231 | 3A991A2 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MK22FN1M0AVMC12 (935318639557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
More about K22_120
Kinetis® K22 MCUs have been optimized for cost-sensitive applications requiring low power flexibility and processing efficiency.
- Delivers optimized low power while providing significant bill-of-materials savings through smart on-chip integration
- Includes options that support crystal-less USB design for reduced system cost and board space
- Provides scalability with various levels of integration, offering a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements
- Shares the comprehensive enablement and scalability of the Kinetis portfolio