MK22FN1M0AVLL12 Product Information|NXP

Features


Kinetis® K22-120 MHz, Cost Effective, Full-Speed USB Microcontrollers (MCUs) based on Arm® Cortex®-M4 Core

Package


LQFP100: LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body

Buy Options

MK22FN1M0AVLL12

Active

12NC: 935322249557

Details

Quantity

Unit Pricing

1 - 25$9.54
26 - 98$8.81
99 - 99$8.07
100+$8.07

Order

$9.54 USD
In Stock:989
Order from distributors

Operating Features

ParameterValue
Core Type
Arm Cortex-M4
Operating Frequency [Max] (MHz)
120
SRAM (kB)
128
Flash (kB)
1024
UART
5
SPI
3
I2C
3
USB Controllers
1
ParameterValue
CAN
1
GPIO
66
ADC (16 bit)
2
16-bit PWM
20
Security
CRC
Supply Voltage [min] (V)
1.71
Supply Voltage [max] (V)
3.6
Ambient Operating Temperature (Min to Max) (℃)
-40 to 105

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MK22FN1M0AVLL12(935322249557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e3
REACH SVHC
685.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MK22FN1M0AVLL12
(935322249557)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MK22FN1M0AVLL12
(935322249557)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MK22FN1M0AVLL12
(935322249557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MK22FN1M0AVLL12
(935322249557)
2020-10-302020-11-30202007015INXP Standardized Tray Attributes for LQFP 14x14 Bulk Shipments
MK22FN1M0AVLL12
(935322249557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about K22_120

Kinetis® K22 MCUs have been optimized for cost-sensitive applications requiring low power flexibility and processing efficiency.

  • Delivers optimized low power while providing significant bill-of-materials savings through smart on-chip integration
  • Includes options that support crystal-less USB design for reduced system cost and board space
  • Provides scalability with various levels of integration, offering a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements
  • Shares the comprehensive enablement and scalability of the Kinetis portfolio