MK20DN512ZVMC10 Product Information|NXP

Features


Kinetis K20: 100MHz Cortex-M4 Performance MCU, 512KB Flash, 128KB SRAM, Full-Speed USB, 121-MAPBGA

Package


LFBGA121: LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.38 mm body

Buy Options

MK20DN512ZVMC10

NRND

12NC: 935324524557

Details

Order

Order from distributors

MK20DN512ZVMC10R

NRND

12NC: 935324524518

Details

Order

Order from distributors

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MK20DN512ZVMC10(935324524557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
167.7
MK20DN512ZVMC10R(935324524518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e1
REACH SVHC
167.7

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MK20DN512ZVMC10
(935324524557)
No
3
260
40
MK20DN512ZVMC10R
(935324524518)
No
3
260
40

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)FootprintCapture Symbol
MK20DN512ZVMC10
(935324524557)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)
MK20DN512ZVMC10R
(935324524518)
854231
3A991A2
 PDF | Cadence Allegro(dra) PDF | Orcad Capture 16.3(olb)

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MK20DN512ZVMC10
(935324524557)
2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MK20DN512ZVMC10R
(935324524518)
MK20DN512ZVMC10
(935324524557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MK20DN512ZVMC10R
(935324524518)
MK20DN512ZVMC10
(935324524557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments
MK20DN512ZVMC10R
(935324524518)

More about K20_100

The Kinetis® K20 100 MHz MCU family offers a scalable portfolio with various levels of integration, featuring a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements.

  • Maximizes board space and enhances performance with minimum-length interconnections
  • Enables miniaturization of existing applications
  • Provides performance efficiency with low power
  • Delivers significant BOM savings through smart on-chip integration
  • Shares the comprehensive enablement and scalability of the Kinetis portfolio
More